A Comparison Between Cold-Welded and Diffusion-Bonded Al/Cu Bimetallic Rods Produced by ECAE Process

Eslami, Parvin Alizadeh; Taheri, Ali; Zebardast, M.

doi:10.1007/s11665-013-0591-2

Cited by 22 publications

(3 citation statements)

References 49 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Among methods of fabricating clad composites include rolling [22,23], extrusion [24,25], explosive welding [26], laser cladding [27], and drawing, roll-cladding is most frequently employed, because it is easy, efficient, and less expensive in comparison with other cladding methods. In clad composites, insufficient interfacial bonding strength between joining metals may cause interfacial debonding and failure.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites

Kim

Hong

2019

Metals

View full text Add to dashboard Cite

The effects of interfacial modification in tri-layered Cu/Al/Cu composites by heat treatment on interface stability and crack propagation were investigated. In order to investigate the crack path during the peel test, the intermetallic compound layer with the propagating crack was examined using electron backscatter diffraction (EBSD) analyses. The increase of peel strength from 7.8 to 9.1 N/mm in the tri-layered Cu/Al/Cu composite in the presence of thin discontinuous intermetallic compounds with heat treatment at 200–300 °C was accompanied by the increase of electrical conductivity from 65.3% IACS (International Annealed Copper Standard) to 66.8% IACS. Continuous intermetallic layers consisting of Al2Cu, AlCu, and Al4Cu9 were found in Cu/Al/Cu heat-treated at temperatures above 350 °C and its thickness increased rapidly and reached up to 35.2 μm at 500 °C. The peel strength drastically decreased to 5.75 N/mm after heat treatment at 400 °C, and it gradually increased as the heat treatment temperature was increased to 450 °C (5.91 N/mm) and 500 °C (6.16 N/mm). The increased peel strengths after heat treatment at 450 and 500 °C were accompanied by pronounced serrations of the peel strength–displacement curves. The amplitude of serration increased substantially with increasing annealing temperature from 400 to 500 °C. The major crack along the interface propagated, mostly along the Al2Cu/AlCu boundary with some inclined cracks, propagated through the AlCu and Al4Cu9 intermetallic compound layers. The repetition of crack propagation along the interface and crack deflection through the intermetallic layer as an inclined crack induced the serrated surface on the peeled-off Cu plate, enhancing the interface toughening.

show abstract

Section: Introductionmentioning

confidence: 99%

“…Clad composites bonded at low temperature can have incomplete bonding and exhibit a higher risk of interface debonding [15,16]. In contrast, processing clad composites at an elevated temperature produces brittle IMCs Al x Cu y [25,28], which have an adverse effect on mechanical integrity and electrical performance.…”

Section: Introductionmentioning

confidence: 99%

Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites

Kim

Hong

2019

Metals

View full text Add to dashboard Cite

show abstract

“…Cu-Al bimetals was fabricated by repeated hydrostatic extrusion and equal channel angular pressing (ECAP) techniques [12,13], but the Cu-Al bimetals result from these techniques have low mechanical strength. Last decades, many works were focused on welding copper to aluminum [14,15]. However, the welding of copper to aluminum is mostly difficult.…”

Section: Introductionmentioning

confidence: 99%

Properties of Al/Cu Bimetallic Plate Prepared by P/M Technique: Sintering Temperature Effect

Ata

2017

JES. Journal of Engineering Sciences

View full text Add to dashboard Cite

The goal of this work was to fabricate an aluminum/copper powder metallurgy bimetal plates at various sintering temperature ranging between 300 o C and 600 o C. Microstructure and properties for sintering specimens were performed to appreciate the effect of sintering temperature on the final Al/Cu bimetal properties. Three intermetallic compounds (IMCs) were detected (Al 2 Cu, Al 4 Cu 9 and AlCu) between Al. and Cu. interface. Cracks were obtained for the specimens that were sintered at 600 o C, lead to weaken and separation of the Al/Cu plates. The maximum strength for bonding was measured for the specimens that were sintered at 500 o C. For the samples which sintered at 500 o C, the lower electrical resistivity was detected where the good sintering was occurred for this specimen.

show abstract

Influences of shape of the new interfaces and morphology of the intermetallics on mechanical properties of aluminum AA2024–pure copper joints by friction stir welding

Anbukkarasi

Kailas

2020

Int J Adv Manuf Technol

View full text Add to dashboard Cite

A Comparison Between Cold-Welded and Diffusion-Bonded Al/Cu Bimetallic Rods Produced by ECAE Process

Cited by 22 publications

References 49 publications

Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites

Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites

Properties of Al/Cu Bimetallic Plate Prepared by P/M Technique: Sintering Temperature Effect

Influences of shape of the new interfaces and morphology of the intermetallics on mechanical properties of aluminum AA2024–pure copper joints by friction stir welding

Contact Info

Product

Resources

About