A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability

Berni, Rossella; Catelani, Marcantonio; Fiesoli, Caterina; Scarano, Valeria L.

doi:10.1109/tr.2015.2455973

Cited by 15 publications

(8 citation statements)

References 20 publications

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“…On the other hand, solder joint fatigue may be accelerated regarding fatigue properties and the strength of the solder joint used (Huang et al, 2020). Microstructural deterioration of solder joints occurs with aging variations (Berni et al, 2016;Al Athamneh et al, 2020).…”

Section: R E T R a Cmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

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Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model. Design/methodology/approach Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed. Findings It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration. Originality value It is confirmed.

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Section: R E T R a Cmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

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“…A survey conducted by IPC and NPL (National Physical Laboratory) in 2012 showed that surface finish solderability is the single most important contributor to PCB defects [98]. Many researchers have reported the impacts of different surface finishes on wettability, mechanical properties, ball pull strength, thermal cycle reliability, drop reliability, vibration reliability, and electromigration reliability of solder joints formed by various solder alloys [99], [100], [109], [101]- [108]. From the PCB manufacturers' perspective, the surface finish selection impacts the manufacturing cost, process, quality, and reliability of the product [110].…”

Section: Figure 6 Selected Solder Pricesmentioning

confidence: 99%

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

et al. 2020

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Due to safety and reliability concerns, various classes and/or applications of electronic products are excluded from the European Union's Restriction of Hazardous Substances (RoHS) regulations requiring the elimination of lead (Pb). However, the majority of electronic devices are now Pb-free. As a result, manufacturers attempting to maintain tin-lead (SnPb) based electronics face an increasing challenge to procure parts and products with Pb-based solder. This paper reviews the challenges of producing Pbbased electronic equipment, the reliability concerns with Pb-free electronics, and the options that manufacturers have for maintaining reliable, Pb-based production. In particular, the paper examines mixed soldering processes and the re-balling of Pb-free electronic parts. While Pb-free electronics present risks, it is our conclusion that the risks are manageable and are lower than those incurred by maintaining an increasingly obsolete Pb-based manufacturing process.

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“…Through a typical Weibull analysis, Dalton et al 21 reported that the solder chemical composition, temperature change within a thermal cycle, along with a maximum dwell temperature remain the crucial parameters for characteristic lifetimes. Employing Weibull-distributed data and non-linear hybrid models, Berni et al 22 claimed that the surface finishes of the printed circuit boards along with the geometry of the joint in common are the dominant influencers on the failure mechanism of the solder interconnection. Other related works typically focused on the reliability assessment of solder joints via conventional statistical methodologies 23 – 25 .…”

Section: Introductionmentioning

confidence: 99%

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

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A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability

Cited by 15 publications

References 20 publications

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

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