A comparison of serial interfaces on energy critical systems

Solheim, Tharald; Grannæs, Marius

doi:10.1109/norchip.2015.7364373

Cited by 7 publications

(1 citation statement)

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“…On the other hand, it is important not to distort the nature of these two protocols, developing therefore an I 2 C firmware that is adherent with the nature of the bus and exploits all the available tools of the microcontroller. For this reason, before explaining the developed framework, it will be first described the I 2 C peripheral of the microcontroller and its features [12] [13] [14]. The I 2 C mode is compatible with any device that communicates with the same protocol, regardless if it is a master or a slave, identifying every element on bus with its unique address.…”

Section: Flexspi Energy Consumption Analysis and Comparison With mentioning

confidence: 99%

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I²C STANDARD

Visconti

Giannotta²,

Brama³

et al. 2017

International Journal on Smart Sensing and Intelligent Systems

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In this paper, we report a detailed description of developed Flex-SPI firmware structure together with experimental tests carried out by using ad-hoc instrumental setups based on TI MSP-EXP430F5438 experimenter boards. Developed framework, aimed to provide a solid base to test the possibility of performing a shared SPI communication with a fixed number of wires without renouncing to push-pull output stage advantages, has been implemented and successfully validated. Also, FlexSPI energy consumption has been evaluated and then compared with the I 2 C one, by proper experimental setups and related data processing: the two protocols, in fact, share several features, although they rely on a different hardware configuration. The energy/bit metric was chosen so that the two output stages can be compared regardless the effective quantity of exchanged packets; thus, this measure provides an indication of necessary energy amount to move a single bit to guarantee the correct firmware functionality. Despite larger quantity of exchanged data due to channel reservation needs (with a 35% traffic overhead, in the performed tests), the FlexSPI total energy consumption is comparable with the I 2 C one, at the same communication speed; thus a lower energy/bit requirement is required for FlexSPI protocol, decreasing with the negotiated speed, in this way proving FlexSPI protocol as a suited and valid choice for high-speed low-consumption communications inside embedded systems with a developed architecture capable of great flexibility.

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Section: Flexspi Energy Consumption Analysis and Comparison With mentioning

confidence: 99%

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I²C STANDARD

Visconti

Giannotta²,

Brama³

et al. 2017

International Journal on Smart Sensing and Intelligent Systems

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Equally Distributed Bus-Communication Access Rights for Inter MCU Communication Using Multimaster SPI

Dentgen

Renner

Mottok

2020

Architecture of Computing Systems – ARCS 2020

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An Ultra Low Power, 3-Wire Serial Interface Design for Data Converters in Pin-Constrainted Applications with 180 nm CMOS Technology

Ali

Rehman

Kim

et al. 2017

2017 International Conference on Frontiers of Information Technology (FIT)

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A comparison of serial interfaces on energy critical systems

Cited by 7 publications

References 1 publication

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I²C STANDARD

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I²C STANDARD

Equally Distributed Bus-Communication Access Rights for Inter MCU Communication Using Multimaster SPI

An Ultra Low Power, 3-Wire Serial Interface Design for Data Converters in Pin-Constrainted Applications with 180 nm CMOS Technology

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A comparison of serial interfaces on energy critical systems

Cited by 7 publications

References 1 publication

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I2C STANDARD

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I2C STANDARD

Equally Distributed Bus-Communication Access Rights for Inter MCU Communication Using Multimaster SPI

An Ultra Low Power, 3-Wire Serial Interface Design for Data Converters in Pin-Constrainted Applications with 180 nm CMOS Technology

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Product

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FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I²C STANDARD

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I²C STANDARD