2021
DOI: 10.1016/j.corsci.2021.109778
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A comparison of the corrosion behaviour of copper materials in dilute nitric acid

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Cited by 23 publications
(15 citation statements)
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“…Previously, it has been shown 33 that the presence of splat boundaries (also called inter-particle interfaces or splat-splat interfaces) is due to the deformation of Cu particles, on impingement at a high kinetic energy. As speculated previously, 33,34,46 the corrosion of CS-Cu could propagate differently in the proximity of splat boundaries and/or at open pore areas than on the surface of the bulk material.…”
Section: Resultsmentioning
confidence: 56%
“…Previously, it has been shown 33 that the presence of splat boundaries (also called inter-particle interfaces or splat-splat interfaces) is due to the deformation of Cu particles, on impingement at a high kinetic energy. As speculated previously, 33,34,46 the corrosion of CS-Cu could propagate differently in the proximity of splat boundaries and/or at open pore areas than on the surface of the bulk material.…”
Section: Resultsmentioning
confidence: 56%
“…49 The greatly reduced surface area would reduce the Au use efficiency and the overall photothermal conversion efficiency. As the crystallographic orientation of grains greatly affects the corrosion behavior and further volume shrinkage, 50 we may control the shrinkage direction of an alloy during dealloying by tuning its crystal orientation, considering that the thickness reduction caused by volume shrinkage has little effect on the photothermal conversion (Figure 1a and b).…”
Section: ■ Introductionmentioning
confidence: 99%
“…The effect of grain refinement resulting from SPD processing on the corrosion resistance for different Al alloys is still unclear. Generally, grain-size reduction results in a significant increase in volume fraction of the intracrystalline regions, such as grain boundaries and triple junctions [ 11 , 12 ], which are more chemically active than grain interiors [ 13 , 14 , 15 , 16 ]. This leads to the accelerated formation of passive films [ 17 ].…”
Section: Introductionmentioning
confidence: 99%