A comparison study for metalized ceramic substrate technologies: For high power module applications

Wei, Vincent; Huang, Megan; Lai, Roger; Persons, Ryan

doi:10.1109/impact.2014.7048425

Cited by 9 publications

(2 citation statements)

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“…The latter has a number of advantages in a wide range of industrial applications. While LTCC coils have been extensively tested in the nuclear fusion context, the same does not hold for HTCC coils, for which more limited testing was carried out [50,52,61]. HTCC coils are rugged, have solid connectors, posing no problems in connecting and mounting them, and were reported to be potentially superior to LTCC [52].…”

Section: High Performance Hybrid Magnetic Sensorsmentioning

confidence: 99%

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Long term operation of the radiation-hard Hall probes system and the path toward a high performance hybrid magnetic field sensor

Quercia

Pironti²,

Bolshakova³

et al. 2022

Nucl. Fusion

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The paper reports a systematic assessment of the Radiation-hard Hall Probes (RHP) magnetic diagnostic system of the JET tokamak, which is based on InSb semiconductor thin ﬁlms, and describes the path that lead to the proposal of an innovative magnetic probe concept. A relevant account of RHP operation during the recent Deuterium-Tritium experimental campaign (DTE2) is also provided, showing correct operation under ITER-like intense neutron ﬂux. The period considered for the systematic assessment of the RHP system ranges from October 2009 to March 2021, during which the machine produced more than 19000 pulses. The RHP system consists of six three-dimensional Hall probes, which have built-in recalibration capability, thanks to the presence of microsolenoids that produce a local known ﬁeld during a tailored automatic pre-pulse calibration sequence, that can also be initiated manually. During pulses, the microsolenoids can also be used as inductive sensors as their signals are recorded as well. Moreover, the system provides temperature measurements at the location of the probes, which are continuously recorded too. The assessment demonstrates accurate long-term operation of the RHP system. All the diagnostic channels reliably provide pre-pulse calibration data and pulse signals and the original sensitivities of the Hall sensors are preserved. Integration considerations and a data fusion analysis lead to the proposal of a high performance, compact, broadband, hybrid ﬁeld probe, consisting of the combination of an inductive coil and a Hall sensor, to be manufactured by means of the coil technology developed for ITER or an alternative concept with improved radiation-hardness. The hybrid probe is expected to deliver the advantages of both inductive and Hall sensing technologies, essentially in the same package size of a single ITER magnetic discrete probe. In particular, it would solve the problem of the drift of the integrator for long lasting burning plasma discharges. The signals produced by the coil and the Hall sensor, processed by means of a Luenberger-Kalman observer, provide a magnetic ﬁeld measurement which is non-drifting and low-noise. For these reasons, the hybrid probe has been proposed as the potential primary magnetic diagnostic sensor for future burning plasma experiments and demonstration fusion power plants.

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Section: High Performance Hybrid Magnetic Sensorsmentioning

confidence: 99%

“…Another promising technology is TPC (thick print copper film), for which are reported, among other properties, a comparatively good thermal conductivity, multilayer circuit capability, sufficient adhesion of copper to alumina and aluminum nitride substrates and resistance to thermal shock cycling [61,62].…”

Section: High Performance Hybrid Magnetic Sensorsmentioning

confidence: 99%

Long term operation of the radiation-hard Hall probes system and the path toward a high performance hybrid magnetic field sensor

Quercia

Pironti²,

Bolshakova³

et al. 2022

Nucl. Fusion

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Highly reliable and cost effective thick film substrates for power LEDs

Gundel

Persons

Bawohl

et al. 2016

2016 IEEE Applied Power Electronics Conference and Exposition (APEC)

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This paper presents Thick Printed Copper (TPC) as substrate technology for High Brightness LEDs, which features a strongly improved reliability combined with a significant cost advantage over incumbent technologies for High Brightness LED substrates. The advantages of TPC over Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) substrates will be demonstrated by thermal shock test results and a demonstration of the versatile design options. The good thermal performance of TPC is demonstrated by comparative Finite Element Modelling of TPC and DBC substrates. A detailed review is given discussing the different copper to ceramic bonding mechanisms, which prevent void formation and are responsible for the excellent thermo-mechanical reliability

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Study on Direct Current Cu Electroplating in Through Ceramic Holes for High-power LED Packaging

Wang

Cheng

Chen

et al. 2020

2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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A comparison study for metalized ceramic substrate technologies: For high power module applications

Cited by 9 publications

References 0 publications

Long term operation of the radiation-hard Hall probes system and the path toward a high performance hybrid magnetic field sensor

Long term operation of the radiation-hard Hall probes system and the path toward a high performance hybrid magnetic field sensor

Highly reliable and cost effective thick film substrates for power LEDs

Study on Direct Current Cu Electroplating in Through Ceramic Holes for High-power LED Packaging

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