2020
DOI: 10.1109/ted.2020.3030567
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A Comprehensive Analysis of the 2-DEG Transport Properties in In x Al1 – x N/AlN/GaN Heterostructure: Experiments and Numerical Simulations

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Cited by 2 publications
(4 citation statements)
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“…The AlN/GaN/AlGaN double heterojunction epitaxy structure is grown on SiC substrate by metalorganic chemical vapor deposition (MOCVD) [8]. Due to the strong polarization effect of AlN, the energy band difference of AlN/GaN is large, so a high concentration of two-dimensional electron gas (2-DEG) can be formed at the interface of the two materials [9][10][11][12]. The negative polarization charge on the back of AlN increases the energy band of the AlGaN barrier, so that the probability of 2-DEG entering AlGaN is greatly reduced.…”
Section: A Gan Hemtmentioning
confidence: 99%
“…The AlN/GaN/AlGaN double heterojunction epitaxy structure is grown on SiC substrate by metalorganic chemical vapor deposition (MOCVD) [8]. Due to the strong polarization effect of AlN, the energy band difference of AlN/GaN is large, so a high concentration of two-dimensional electron gas (2-DEG) can be formed at the interface of the two materials [9][10][11][12]. The negative polarization charge on the back of AlN increases the energy band of the AlGaN barrier, so that the probability of 2-DEG entering AlGaN is greatly reduced.…”
Section: A Gan Hemtmentioning
confidence: 99%
“…The LM In x Al 1-x N/AlN/GaN epilayer with In fraction of around 18% was grown on SiC substrates using metalorganic chemical vapor deposition (MOCVD) with the detailed structure given in our previous work [1]. Four different devices were fabricated on the same wafer substrate, including conventional depleted (MS HEMT), pure fluorine ion-implanted (FII HEMT), NiO x -based (NiO HEMT), and fluorine treatment combined with NiO x gate (F-NiO HEMT).…”
Section: Device Fabrication and Structurementioning
confidence: 99%
“…The presence of F ions away from the 2DEG channel is considered to be negligible. Note that the epitaxial structure and corresponding physics parameters used in Eq.1 were based on our previous work [1], and the doping concentration of the GaN substrate was assumed to be negligible (unintentional doping). Compared to conventional AlGaN/GaN, the InAlN/AlN/GaN interface has a higher charge density (2.03 × 10 cm -2 ) due to its stronger spontaneous polarization strength.…”
Section: Device Fabrication and Structurementioning
confidence: 99%
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