A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement strategies

Polymeric reinforcement approaches and materials selection to improve board-level drop reliability of SnAgCu soldered area array packages

“…The polymeric reinforcement approaches include full capillary flow underfill (FCFU), partial capillary flow underfill (PCFU), edge bond adhesive (EBA), and corner bond adhesive (CBA) [4][5][6][7][8][9][10][11][12][13]. Although no-flow underfill, epoxy flux, and preform underfilm technologies are available in the marketplace, high volume manufacturing (HVM) of these approaches has not been adopted due to their shortcomings [14][15][16][17].…”