A Comprehensive Review of Electronic Cooling Technologies in Harsh Field Environments: Obstacles, Progress, and Prospects

Abstract

Electronic cooling is crucial for modern electronic device design, ensuring devices operate at peak performance, reliability, and longevity. This paper offers an in-depth critical review of electronic cooling technologies, covering both established methods and recent innovations. It explores the challenges in electronic cooling, such as effective heat dissipation, thermal management, and reliability concerns. Various cooling strategies are examined, including air cooling, liquid cooling, phase-change cooling, and emerging technologies like thermoelectric cooling and two-phase immersion cooling. The paper also evaluates recent advancements in materials, design, and manufacturing processes that have transformed electronic cooling. Additionally, it discusses the impact of electronic cooling on energy efficiency, environmental sustainability, and cost-effectiveness. Finally, the review highlights future research directions and opportunities for innovation in electronic cooling to meet the increasing demands of high-performance electronic systems. The findings provide valuable insights for thermal design engineers, assisting in optimal IC chip placement on the substrate board to enhance reliability and extend operational lifespan.