A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

Wang, Jing; Niu, Yuling; Shao, Shuyan; Wang, Huayan; Xu, Jiefeng; Pham, V.D.; Park, Seungbae

doi:10.1016/j.microrel.2020.113791

Cited by 24 publications

(8 citation statements)

References 26 publications

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“…However, in actual devices, the adhesive interface delaminates easily, which is a serious problem. Adhesion cannot be maintained under significant thermal stresses, such as solder reflow processes and temperature cycling tests. , Delamination of the adhesive interface accelerates crack generation and propagation in the die bonding area and results in rapid deterioration of the device’s heat dissipation. Such fatal flaws can then cause a loss of functionality in the power device.…”

Section: Introductionmentioning

confidence: 99%

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Tsurumi¹,

Tsuji

Masago

et al. 2021

ACS Omega

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Clarification of adhesive interactions in semiconductor packages can improve reliability of power electronics. In this study, the adhesion interfaces between the epoxy molding compound and Cu-based lead frames were analyzed using the density functional theory. A resin fragment was prepared based on the polymer framework formed in the curing reaction of epoxy cresol novolac (ECN) and phenol novolac (PN), which are typical molding materials. The resin fragment was optimized on the surfaces of Cu and Cu 2 O. We calculated the charge density differences for adhesion structures and discussed the origin of adhesive interactions. The ECN–PN fragment’s adhesion to the Cu surface relied mainly on dispersion forces, whereas in the case of Cu 2 O, the resin bonded chemically to the surface via (1) σ-bonds formed between the ECN–PN’s OH group oxygen and coordinatively unsaturated copper (Cu CUS ) and (2) hydrogen bonds between resin’s OH groups and coordinatively unsaturated oxygen (O CUS ) located close to to Cu CUS , resulting in a stable adhesive structure. The energy required to detach the resin fragment from the optimized structure was determined using the nudged elastic band method in each model of the adhesive interface. Morse potential curve was used to approximate the obtained energy, and the energy differentiation by detachment distance yielded the theoretical adhesive force. The maximum adhesive stress was 1.6 and 2.2 GPa for the Cu and Cu 2 O surfaces, respectively. The extent to which the ECN–PN fragment bonded to the Cu 2 O surface stabilized was 0.5 eV higher than in the case of the Cu surface.

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Section: Introductionmentioning

confidence: 99%

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Tsurumi¹,

Tsuji

Masago

et al. 2021

ACS Omega

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“…The transient moisture-induced stress analysis was performed as a coupled temperature displacement analysis. 21,30,31 First, assuming that there is no heat or temperature source in the material, the equation of the temperature field is as follows…”

Section: Simulation Computing Methodsmentioning

confidence: 99%

“…The transient moisture-induced stress analysis was performed as a coupled temperature displacement analysis. 21,30,31…”

Section: Moisture Induced Stressesmentioning

confidence: 99%

An experimental and finite element simulation study of moisture absorption in an ordered PVAF-reinforced thermoplastic starch composite film

Zhang

Guo

et al. 2022

Polymers and Polymer Composites

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A two-dimensional (2D) model was established by the finite element method to study the transient hygroscopic process and moisture-induced stress to better understand the moisture absorption microscopic process of ordered polyvinyl alcohol fiber (PVAF)-reinforced thermoplastic starch (TPS) composite films and the corresponding moisture-induced stress. The Mises stress contour of moisture distribution at five time points (36, 68, 100, 176, and 348 h) under four relative humidities (RH=57%, 75%, 84%, 98%) is demonstrated. The variation in moisture content along the two paths of width (AB) and thickness (CD) in the 2D model and the moisture-induced stress were also studied in detail. The results show that when the time t is 348 h, the saturated moisture contents along CD are 5.27, 17.22, 30.58, and 59.14%, and along AB are 5.27, 17.19, 30.57, and 59.07%. In addition, the change in moisture content, regardless of whether the path was AB or CD, mainly occurred before 176 h. The simulation results of moisture absorption are in good agreement with the experimental results. The ultimate moisture-induced stress is the largest in the fiber surroundings, which are 0.398, 1.30, 2.31, and 4.48 MPa at four RHs, respectively, and the internal moisture stress of 4.48 MPa was within the tensile strength (2–6 MPa) of PVAF/TPS (PVAF <0.89 vt%), which resulted in composite film failure. This paper provides a new way to understand the moisture absorption mechanism and explore possible methods for improving the water-resistance of TPS films.

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“…In electronic packaging, the discontinuity of materials under heterogeneous integration also causes the discontinuity of moisture concentration diffusion, and Fick’s law cannot be applied simply by analogy with thermal diffusion [ 25 , 26 ]. So Wong et al [ 27 ] proposed the normalization method: introduce the normalized wet concentration

(the ratio of wet concentration to saturated wet concentration,

) to solve the problem of discontinuity of different interfacial parameters of the two phases of the material:

…”

Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%

“…Dong et al [ 43 ] utilized an electro-thermal–wet coupling model to realize stress coupling under thermal cycling and wet expansion, and the results showed that the coupled stress of the silicon chip increased by 2.6 MPa to 26.361 MPa after the introduction of wet expansion compared to thermal stress alone ( Figure 3 a). Wang [ 27 ] chose the virtual crack closure technique (VCCT) to introduce the effect of CTE–CHS–vapor pressure superposition on the delamination of two-phase interfaces for simulation; it was found that the strain energy release rates produced by hygroscopic loading G h and vapor pressure loading G p were similar in magnitude to those produced by thermal loading G t ( Figure 3 c,d). This result suggests that, in addition to the effect of temperature, moisture and vapor pressure also play an important role in delamination in stacked mold encapsulation.…”

Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

Cited by 24 publications

References 26 publications

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

An experimental and finite element simulation study of moisture absorption in an ordered PVAF-reinforced thermoplastic starch composite film

Delamination of Plasticized Devices in Dynamic Service Environments

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