A Conduction-Cooled Module for High-Performance LSI Devices

Oktay, S.; Kammerer, H. C.

doi:10.1147/rd.261.0055

Cited by 66 publications

(11 citation statements)

References 2 publications

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“…TCM requirements are outlined by Oktay and Kammerer. 9 The nominal internal resistance of the TCM, from the chip junction to TCM hat, is about 8 K/W, and R ext. = 0.02 K/W, this results in a chip junction temperature of 55 o C ± 8 o C, which is well below the required 85 o C. The 8 o C uncertainty in the above estimates is due to variability in surface roughness, geometry, chip tilt etc., which are inherent in any product.…”

Section: Ibm 3081mentioning

confidence: 99%

Data Centers and Thermal Management Approaches

Sammakia

Joshi

Agonafer

et al. 2014

Encyclopedia of Thermal Packaging

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Section: Ibm 3081mentioning

confidence: 99%

Data Centers and Thermal Management Approaches

Sammakia

Joshi

Agonafer

et al. 2014

Encyclopedia of Thermal Packaging

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“…where 0 is the cross-sectional average velocity in the channel and Dco the channel hydraulic diameter, depends on the width Wand height H of the channel: (2) For all of the fin configurations studied in this work, the width is 12.7 mm and the height is fixed at H = h + t to maintain zero tip clearance. In presenting the friction factor and some of the heat transfer data, a Reynolds number based on the maximum velocity and the fin hydraulic diameter is used.…”

Section: Data Reductionmentioning

confidence: 99%

“…The currently used indirect liquid cooling techniques [1][2][3][4] are already approaching limits and hence, if the projected heat fluxes are to be realized, the only recourse may be cooling by direct immersion in dielectric liquids.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of Convective Heat Transfer From Small Heat Sources to Liquid Coolants Using Strip Fins

Brinkmann

Ramadhyani

Incropera

1987

Experimental Heat Transfer

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Experiments have been performed to assess the effect of four different longitudinal and offset strip fin arrangements on heat transfer from a small (12.7 mm x /2.7 mm), liquid-cooled heat source mounted flush with one wall of a rectangular duct. In terms strictly of thermal performance, the largest heat transfer enhancement is clearly associated with an offset arrangement and amounts to factors of more than 9 and 20 in water and a dielectric fluorocarbon (3M FC-77), respectively. However, on the basis of a fixed pressure drop, the preferred offset strip fin is only marginally superior to the other fins and there is, in fact, little difference between the four arrangements. On the basis of equal pumping power, one of the offset strip fins is clearly superior, but either of the offset fins would be preferred to the longitudinal fins in order to minimize the flow rate and overall pressure drop/pumping power. Standard Nusselt number correlations do not well predict the present data.

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“…The paper by Oktay and Kammerer [8] in this issue discusses the thermal, mechanical, and environmental experiments, as well as the extended threedimensional analytic modehng required to develop the TCM.…”

Section: Array Chipsmentioning

confidence: 99%

System Development and Technology Aspects of the IBM 3081 Processor Complex

Pittler

Powers²,

Schnabel

1982

IBM J. Res. & Dev.

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The IBM 3081 Processor Complex consists of a 3081 Processor Unit and supporting uriits for processor control, power, and cooling. The Processor Unit, completely implemented in LSI technology, has a dyadic organization of two central processors, each with a 26-ns machine cycle time, and executes System/370 instructions at approximately twice the rate of the IBM 3033. This paper presents an overview of the advances in technology and in the design process, as well as enhancements in the system design that were associated with the development of the IBM 3081. Application of LSI technology to the design of the 3081 Processor Unit, which contains almost 800 000 logic circuits, required extensions to silicon device packaging, interconnection, and cooling technologies. A key achievement in the 3081 is the incorporation of the thermal conduction module (TCM), which contains as many as 45 000 logic circuits, provides a cooling capacity of up to 300 W, and allows the elimination of one complete level of packagirig-the card level. Reliability and serviceability objectives required new approaches to error detection and fault isolation. Innovations in system packaging and organization, and extensive design verification by software and hardware models, led to the realization of the increased performance characteristics of the system.

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A Conduction-Cooled Module for High-Performance LSI Devices

Cited by 66 publications

References 2 publications

Data Centers and Thermal Management Approaches

Data Centers and Thermal Management Approaches

Enhancement of Convective Heat Transfer From Small Heat Sources to Liquid Coolants Using Strip Fins

System Development and Technology Aspects of the IBM 3081 Processor Complex

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