2017
DOI: 10.1007/s10854-017-7467-4
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A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds

Abstract: EMC. New information obtained in this research can help the search of new processes and techniques to counter or reduce the chlorine-induced corrosion of devices and packages. The corrosion test method presented may possibly become an acceptable test standard to consider.

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Cited by 24 publications
(13 citation statements)
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“…The beneficial effect of AlCl 3 consists in its hydrolysis into highly soluble complexes: Al(H 2 O) 6 3+ (pH < 3.6), [Al(OH)(H 2 O) 4 ] 2+ and [Al(OH) 2 (H2O) 2 ] + (pH~4), [Al(OH)(H 2 O) 4 ] 2+ and [Al(OH) 4 ] − (5.2 < pH < 6.7), and [Al(OH) 4 ] − (pH > 7.0) [ 117 , 118 ]. According to those data, the measured pH corresponded to the Al(H 2 O) 6 3+ soluble compound, i.e., the hydrolysis of the AlCl 3 salt delivered rather a large amount of chlorine ions, which are known to promote aluminum corrosion [ 119 , 120 ]. In studies [ 121 , 122 ], CaCl 2 was reported to be hydrolyzed with the formation of [CaOH] + ; the fraction of the ‘released’ chlorine ions, however, was far less than that for AlCl 3 .…”
Section: Resultsmentioning
confidence: 99%
“…The beneficial effect of AlCl 3 consists in its hydrolysis into highly soluble complexes: Al(H 2 O) 6 3+ (pH < 3.6), [Al(OH)(H 2 O) 4 ] 2+ and [Al(OH) 2 (H2O) 2 ] + (pH~4), [Al(OH)(H 2 O) 4 ] 2+ and [Al(OH) 4 ] − (5.2 < pH < 6.7), and [Al(OH) 4 ] − (pH > 7.0) [ 117 , 118 ]. According to those data, the measured pH corresponded to the Al(H 2 O) 6 3+ soluble compound, i.e., the hydrolysis of the AlCl 3 salt delivered rather a large amount of chlorine ions, which are known to promote aluminum corrosion [ 119 , 120 ]. In studies [ 121 , 122 ], CaCl 2 was reported to be hydrolyzed with the formation of [CaOH] + ; the fraction of the ‘released’ chlorine ions, however, was far less than that for AlCl 3 .…”
Section: Resultsmentioning
confidence: 99%
“…The previous work in corrosion research indicated that the existence of Al2O3 accelerated the penetration of the chlorine ion (Cl − ) and thus corrosion occurred [24]. The mechanism of how the corrosion induced by moisture and Cl − occurred was also proposed by Fu et al [25].…”
Section: Yield and Reliability Of The Ald-coated Asic Chipmentioning
confidence: 89%
“…The previous work in corrosion research indicated that the existence of Al 2 O 3 accelerated the penetration of the chlorine ion (Cl − ) and thus corrosion occurred [24]. The mechanism of how the corrosion induced by moisture and Cl − occurred was also proposed by Fu et al [25]. Figure 5 shows how the ALD coating protected the printed circuit board (PCB) structure; the alumina layer prevented moisture from penetrating into the main chip, while also facilitating good heat dispatch.…”
Section: Yield and Reliability Of The Ald-coated Asic Chipmentioning
confidence: 89%
“…The pattern of microdots sputtered creates hundreds of “wire bond” interfaces within a few square centimeters of wafer used. The corrosion of the simulated devices was observed under high resolution optical microscope while immersed in a 5–20 ppm chloride solution at pH 5 (to simulate the contaminant from epoxy molding compound leading to actual corrosion of the WBD [5] ) and was found to closely resemble the corrosion of wire bonds of real copper wire bonded devices under same immersion conditions. By using this rapid and less costly technique, the authors had a faster turn-around time for determining a major corrosion pathway in Cu WBDs, and allowed for testing various corrosion inhibitors and inhibitor application methods that demonstrated corrosion protection when applied to real copper WBDs.…”
Section: Methods Detailsmentioning
confidence: 99%