“…[1,2] Generally, polymer-based composites have been extensively accepted in thermal management with processability, electrical insulation, and low-cost advantages. [3,4] However, the intrinsic thermal conductivity (TC) of neat polymer, in the range of 0.2-0.5 W/(mÁK), cannot fulfill the thermal diffusion requirement of highpower electronic devices. [5,6] In order to obtain exceptionally thermally conductive polymers, several nanofillers, such as carbon-based nanomaterials (graphene, carbon nanotubes), [7][8][9] metal fillers (Ag, Cu, and Fe), [10][11][12] ceramic fillers (Al 2 O 3 , SiC, and BN), [13][14][15] and hybrid fillers [16][17][18] have been introduced in the polymer matrix.…”