2022
DOI: 10.1007/s42114-022-00584-2
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A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices

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Cited by 103 publications
(37 citation statements)
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“…The mechanism of heat conduction in the XLPE is phonon heat conduction, which means the heat is carried away by lattice vibrations (phonons) [21]. The crystal structure interface, micropores, and additives are the anharmonicity in the thermal conductive network, thus leading to phonon scattering [22]. This is the reason for the formation of thermal resistance.…”
Section: Analysis Of the Temperature Field Effectmentioning
confidence: 99%
“…The mechanism of heat conduction in the XLPE is phonon heat conduction, which means the heat is carried away by lattice vibrations (phonons) [21]. The crystal structure interface, micropores, and additives are the anharmonicity in the thermal conductive network, thus leading to phonon scattering [22]. This is the reason for the formation of thermal resistance.…”
Section: Analysis Of the Temperature Field Effectmentioning
confidence: 99%
“…The study of the thermal conductivity of biochar-filled bioepoxy hemp fiber composite can provide valuable insights into the material’s thermal properties with potential practical implications in various fields, including insulating materials for buildings and thermal management systems for the devices, energy-efficient applications, material selection, and product design with positive impact to the environment. , The thermal conductivity of a material affects its heat transfer behavior. Its study in biocarbon-bioepoxy-hemp fiber composites can improve the understanding of the insulating efficiency of the material against heat transfer.…”
Section: Introductionmentioning
confidence: 99%
“…[1,2] Generally, polymer-based composites have been extensively accepted in thermal management with processability, electrical insulation, and low-cost advantages. [3,4] However, the intrinsic thermal conductivity (TC) of neat polymer, in the range of 0.2-0.5 W/(mÁK), cannot fulfill the thermal diffusion requirement of highpower electronic devices. [5,6] In order to obtain exceptionally thermally conductive polymers, several nanofillers, such as carbon-based nanomaterials (graphene, carbon nanotubes), [7][8][9] metal fillers (Ag, Cu, and Fe), [10][11][12] ceramic fillers (Al 2 O 3 , SiC, and BN), [13][14][15] and hybrid fillers [16][17][18] have been introduced in the polymer matrix.…”
Section: Introductionmentioning
confidence: 99%