A critical review on the chemical wear and wear suppression of diamond tools in diamond cutting of ferrous metals

Guo, Jun; Zhang, Jianguo; Pan, Yingling; Kang, Renke; Namba, Yoshiharu; Shore, Paul; Yue, Xiaobin; Wang, Baorui; Guo, Dongming

doi:10.1088/2631-7990/ab5d8f

Cited by 77 publications

(12 citation statements)

References 105 publications

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“…To date, it is well known that the superlubricity of DLC is expressed by conversion from sp 3 - to sp 2 -hybridized bonding. For this reason, many possible mechanisms surrounding the graphitization of DLC are being investigated: (1) thermal-induced phase transition with hot-spots or flash temperature, − (2) local pressure- and local stress-induced relaxation of the metastable sp 3 phase, , (3) removal of cooling effect of water molecules, , and (4) wear- or shear-induced graphitization. − …”

Section: Resultsmentioning

confidence: 99%

Superlubricity with Graphitization in Ti-Doped DLC/Steel Tribopair: Response on Humidity and Temperature

Kim

Lee

Tokoroyama

et al. 2023

ACS Appl. Mater. Interfaces

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The anti-friction of diamond-like carbon (DLC) is achieved by a well-developed carbonaceous transfer layer, and Ti-doped DLC is developed into a robustly built-up carbonaceous transfer layer. The friction performance of DLC depends on the operating environment, e.g., ambient gas, humidity, temperature, lubricants, and mating material. In this study, we aimed to reveal the environmental sensitivities of Ti-DLC on friction characteristics. To this end, a Ti-DLC was rubbed against a steel ball, and friction behaviors were evaluated with different gas compositions, humidity, and temperature. Finally, we identified that fractional coverage of water on surfaces affected the anti-graphitization on Ti-DLC, leading to avoiding friction reduction.

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Section: Resultsmentioning

confidence: 99%

Superlubricity with Graphitization in Ti-Doped DLC/Steel Tribopair: Response on Humidity and Temperature

Kim

Lee

Tokoroyama

et al. 2023

ACS Appl. Mater. Interfaces

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“…The total thickness of the coating film was 750 nm, comprising a 250-nm-thick Ti interlayer and a 500-nm-thick ta-C coating layer. A Ti layer was inserted as an interlayer to improve the adhesion between the substrate, and ta-C and to prevent any possible graphitization induced thermal decomposition of carbide bond with Co. Weak carbide-forming metals such as Co lead to result in Csp 2 bonds due to thermal decomposition at high temperatures 19 – 21 . A description of the equipment is provided in Ref.…”

Section: Methodsmentioning

confidence: 99%

Thermal stability of Si/SiC/ta-C composite coatings and improvement of tribological properties through high-temperature annealing

Jang

Kim

et al. 2022

Sci Rep

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We report the structure, mechanical properties, thermal stability, and durability of Si/SiC/ta-C composite (Si–ta-C) coatings fabricated using simultaneous filtered cathodic vacuum arc deposition and direct current unbalanced magnetron sputtering. Si concentration of 1.25–6.04 at.% was achieved by increasing the unbalanced magnetron sputtering power from 25 to 175 W. Si addition provided functionality to the coating, such as heat resistance, while retaining the high hardness of ta-C coatings. The Si–ta-C coatings were stable up to 600 °C regardless of the Si content, while the coating containing 3.85 at.% Si was stable up to 700 °C. The friction behavior and mechanical properties were dependent on the coating film before and after annealing at 100–200 °C; however, annealing at 300–400 °C decreased disk wear and increased counterpart wear due to an increase in film hardness on account of an endothermic reaction that increased the number of Si–C bonds. This indicates that the basic hardness characteristics of the ta-C coating and the high-temperature structural change of the Si–ta-C coating are important for ensuring high-temperature durability. These characteristics were verified through the low coefficient of friction and wear rate of the 1.25 at.% Si–ta-C coating after annealing at 500 °C.

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“…Pseudopotentials for Cu, C, and H atoms were PBE potentials obtained from the Standard Solid State Pseudopotential library [29], which have been used to reveal basic interfacial bonding features [12,[30][31][32], as they provide a good balance between accuracy and efficiency. Dispersion interactions are not considered in this work, as they primarily contribute to a long-range background, which could be featureless at the atomic scale [33,34]; instead, this study focused on adhesion due to strong chemical bonding, which is the leading cause of chemical wear and atomic transfer in tool-work contact [24,35]. Based on convergence tests shown in Fig.…”

Section: First-principles Calculationsmentioning

confidence: 99%

“…In this work, a series of first-principles calculations will be performed to study the initial stage of nanoindentation. This simulation study aims to reveal the tool-work adhesion, which is a common phenomenon that weakens process accuracy and induces tool wear [21][22][23][24][25]. The main discussion focuses on the nature of interaction and the effects of the interface lattice on adhesion.…”

Section: Introductionmentioning

confidence: 99%

Insight into Atomic-Scale Adhesion at the C–Cu Interface During the Initial Stage of Nanoindentation

et al. 2022

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Adhesion is a common phenomenon in nanomachining which affects processing accuracy and repeatability. As material removal approaches the atomic or close-to-atomic scale, quantum mechanics becomes the dominant principle behind the atomic-level interaction. However, atomic-scale effects cannot be properly described by empirical potential function-based molecular dynamics simulations. This study uses a first-principles method to reveal the atomic-scale adhesion between a diamond tip and a copper slab during initial-stage nanoindentation. Using a simplified tip and slab model, adhesion energy, electronic distribution, and density of states are analyzed based on quantum chemistry calculation. Results show that atomic adhesion is primarily due to the covalent bonding interaction between C and Cu atoms, which can induce structural changes to the diamond tip and copper slab. The effects of tip position and angles on adhesion are further studied through a series of simulations. The results show that adhesion between the tip and slab is sensitive to the lattice structure and a variant in angstroms is enough to cause different adhesion and structural changes. The actual determinants of adhesion can only be the atomic and electronic structures at the tip–slab interface. Bond rotation and breakage are observed during simulation and their effects on adhesion are further discussed. To conclude, the first-principles method is important for the analysis of an atomic-scale interaction system, even if only as an aid to describing adhesion at atomic and electronic scales.

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A critical review on the chemical wear and wear suppression of diamond tools in diamond cutting of ferrous metals

Cited by 77 publications

References 105 publications

Superlubricity with Graphitization in Ti-Doped DLC/Steel Tribopair: Response on Humidity and Temperature

Superlubricity with Graphitization in Ti-Doped DLC/Steel Tribopair: Response on Humidity and Temperature

Thermal stability of Si/SiC/ta-C composite coatings and improvement of tribological properties through high-temperature annealing

Insight into Atomic-Scale Adhesion at the C–Cu Interface During the Initial Stage of Nanoindentation

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