A crystal plasticity FEM study of through-thickness deformation and texture in a {112} <111> aluminium single crystal during accumulative roll-bonding

Abstract

In this study, a crystal plasticity finite element method (CPFEM) model was used to study the deformation behaviour in an aluminium single crystal (1 1 2)[1 1 -1] processed by accumulative roll-bonding (ARB) up to 9 cycles. The simulation followed the real ARB process based on the developed finite element model. The predicted through-thickness texture matches well with the experimental observations. The deformation behaviours, in terms of crystal rotation, shear strain and slip system activation, in the first and second cycles (conventional rolling) were unidirectional, but the deformation was altered after ARB was applied from the third cycle onwards. Such alteration was found to be caused by the thickness position change and deformation discontinuity at interfaces, which were investigated in detail. The role that interfaces play became dominant over thickness position change as increasing ARB cycles.

A virtual laboratory based on full-field crystal plasticity simulation to characterize the multiscale mechanical properties of AHSS

“…Recently, full-field CP modeling, either employing finite element method (CPFEM) 19 – 21 or spectral method (CPSM) 22 , 23 based on fast Fourier transform as the solver of boundary value problems, has received growing interest in characterizing the anisotropic behavior of polycrystalline materials. Full-field CP modeling, taking both grain microstructure and crystallographic texture as input, can guarantee the stress equilibrium and strain compatibility among grains and has the advantage over the mean-field ones in terms of considering the authentic multiphase/polycrystalline microstructures and describing the stress/strain partitions among phases and grains 23 , 24 .…”

A Virtual Laboratory Based on Full-Field Crystal Plasticity Simulation to Characterize the Multiscale Mechanical Properties of AHSS

“…Recently, full-field CP modeling, either employs a finite element method (CPFEM) 19,20,21 or a spectral method (CPSM) 22,23 based on fast Fourier transformation as the solve of boundary-value problems, has received growing interest in characterizing the anisotropic behavior of polycrystalline materials. The full-field CP modeling, taking both grain microstructure and crystallographic texture as input, can guarantee the stress equilibrium and strain compatibility at grain boundaries and has the advantage over the mean-field ones of considering the authentic multiphase/polycrystalline microstructures and of describing the stress/strain partitions among different phases and grains 23,24 .…”

Influence of Surface Texture and Composition on Graphene Growth by Chemical Vapor Deposition on Cu–Ni Alloys for Field Emission Application

“…It is well known that plastic strain, especially during rolling and wire drawing, at material surface may be significantly different compared to that in the interior. Therefore, there may be texture heterogeneity through the thickness of the material. − For bulk texture measurements, deformed samples were cut into two pieces at the middle and then texture is measured on both cut pieces of the deformed samples.…”