A Cyclic Scheduling Approach to Single-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

Wang, Jipeng; Pan, Chunrong; Hu, Hesuan; Li, Liang; Zhou, Yuan

doi:10.1109/tase.2018.2878063

Cited by 32 publications

(15 citation statements)

References 56 publications

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“…This is a prominent constraint in wafer production. Wang et al [5] studied the scheduling problem of multi-wafer types in cluster tools with residency time constraints. They developed multiplex backward sequence strategy and virtual module technology to optimize the research problem.…”

Section: Literature Reviewmentioning

confidence: 99%

Cyclic Scheduling of Single-Arm Cluster Tools with Multiple Wafer Types: A Case Study

Tian

2022

Advances in Transdisciplinary Engineering

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Cluster tools are widely used in the industrial production process, such as semiconductor wafers, printing circuit board and other fields. In this paper, the scheduling problem of cluster tools with multi-type wafers is studied, including robot handling jobs sequencing and wafer processing sequencing. Based on the detailed analysis of the operations in the problem, there are the processing time window constraints, robot available constraints, processing capacity constraints. Then, due to the complexity in the general conditions, a case with four different wafers (including one for each type in a cycle) is considered. The applied model was solved by the third-party library Gurobi in PyCharm.

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Section: Literature Reviewmentioning

confidence: 99%

Cyclic Scheduling of Single-Arm Cluster Tools with Multiple Wafer Types: A Case Study

Tian

2022

Advances in Transdisciplinary Engineering

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“…If R > m i (10) x g+h×n i = 1; (11) R = max(R−1, 0); (12) For f = 1 to q (13) If (g + h×n i − f )/q is a non-negative integer (14) x f = 1; (15) x f = x f ; (16) Perform one of Algorithms 1 and 2 for Step s; (17) If…”

Section: Formentioning

confidence: 99%

“…By co time variation, an adaptive scheduling method is presented for clu delay constraints in [11]. With WRTCs and multiple wafer types bein scheduling approaches are proposed for SACTs in [12] and DACTs For process-bound cluster tools, robot tasks take much less tim wafer in a PM such that the system cycle time is determined by the pleting a wafer at the bottleneck step. Hence, in a cycle, the robot has treated as robot waiting time.…”

Section: Introductionmentioning

confidence: 99%

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Scheduling of Single-Arm Cluster Tools with Residency Time Constraints and Chamber Cleaning Operations

Qiao

Zhang

et al. 2021

Applied Sciences

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To ensure wafer quality, engineers have to impose wafer residency time constraints and chamber cleaning operations on cluster tools; this has been widely used in semiconductor manufacturing. Wafer residency time constraints and chamber cleaning operations make the scheduling problem of cluster tools more challenging. This work aims to solve such a scheduling problem for single-arm cluster tools and presents a novel method based on the use of virtual wafers. Under a one-cyclic schedule obtained for single-arm cluster tools without chamber cleaning requirements, virtual wafers are loaded into the tool such that when a process module (PM) processes virtual wafers, a chamber cleaning operation is performed in practice. The key to solve this scheduling problem is to find a wafer loading sequence with the highest performance in terms of cycle time. With this idea, this work constructs a genetic algorithm to search for such a solution. Since the obtained solution is a periodical wafer loading sequence based on a one-wafer cyclic schedule, it can be easily implemented. Therefore, this work has high practical value to numerous semiconductor manufacturers. Experiments were performed to show the efficiency and effectiveness of the proposed method.

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“…Over the past decades, researchers conducted extensive prominent studies with respect to scheduling cluster tools under diverse instances, including wafer residency time constraints (WRTCs) [10]- [15], activity time variation [16]- [20], wafer revisiting processes [21]- [27], PM failures [28], [29], chamber cleaning operation [1], [30]- [32], and multi-cluster tools [33]- [42], which are thoroughly reviewed in [43]. Moreover, the latest advancements can be found in [44], [45]. Note that all the aforementioned works are dedicated to the scheduling and control problems of single-wafer-type fabrication.…”

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confidence: 99%

Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints

Wang

Pan

et al. 2020

IEEE/CAA J. Autom. Sinica

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A Cyclic Scheduling Approach to Single-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

Cited by 32 publications

References 56 publications

Cyclic Scheduling of Single-Arm Cluster Tools with Multiple Wafer Types: A Case Study

Cyclic Scheduling of Single-Arm Cluster Tools with Multiple Wafer Types: A Case Study

Scheduling of Single-Arm Cluster Tools with Residency Time Constraints and Chamber Cleaning Operations

Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints

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