A data-informed review of scientific and technological developments and future trends in hot stamping

Li, Jiaqi; Tong, Chenpeng; Zhang, Ruiqiang; Shi, Zhusheng; Lin, Jianguo

doi:10.1016/j.ijlmm.2023.11.003

Cited by 2 publications

(1 citation statement)

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“…The transport of Zn to the GBs can happen by solid-state diffusion (solid metal-induced embrittlement, SMIE) [8], by liquid Zn (liquid metal-induced embrittlement, LMIE), or even due to Zn vapor [9]. Since Zn liquifies at quite a low temperature of 420 • C, LMIE is the most prominent process that has been a topic for more than 100 years, and it is still the focus of recent research [10][11][12][13][14][15][16][17][18][19][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Multiscale Investigation of Microcracks and Grain Boundary Wetting in Press-Hardened Galvanized 20MnB8 Steel

Arndt,

Kürnsteiner,

Truglas

et al. 2023

Metals

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Grain boundary wetting as a preliminary stage for zinc-induced grain boundary weakening and embrittlement in a Zn-coated press-hardened 20MnB8 steel was analyzed using electron backscatter diffraction, Auger electron spectroscopy, energy dispersive X-ray analysis, atom probe tomography and transmission electron microscopy. Microcracks at prior austenite grain boundaries were observed. Structures that developed after microcrack formation were identified: for example, Zn/Fe intermetallic phases with grain sizes smaller than 100 nm were present at the crack surfaces and the wedge-shaped crack tips. An electrolytically coated reference sample that underwent the same heat treatment as the press-hardened material but without the application of tensile stress was investigated in order to find the initial cause of the microcracks. On this sample, Zn, in the order of one atomic layer, was found along prior austenite grain boundaries several micrometers away from the actual Zn/Fe phases in the coating. The resulting grain boundary weakening with the Zn wetting of prior austenitic grain boundaries during austenitization and/or hot forming is a necessary precondition for microcrack formation.

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