SSP
 2012
DOI: 10.4028/www.scientific.net/ssp.187.215
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A Descum Review for Cleaning Surfaces in Polymer Embedded Process Flows

Geraldine Jamieson1,
Carine Gerets2,
F. Duval3
et al.

Abstract: In this paper we review the effects of the plasma descum steps used in current process flows for the fabrication of Cu interconnects embedded in polymer, paying particular attention to polymer residues that are not easily removed in a gentle oxygen only plasma.

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