2017 18th International Conference on Electronic Packaging Technology (ICEPT) 2017
DOI: 10.1109/icept.2017.8046433
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A design of S-band monolithic integrated switched filter bank

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“…To address the above challenging issues, researchers focus on exploring different fabrication processes to improve the integration and compactness, including multilayer printed circuit board (PCB) [3][4][5], low temperature cofired ceramic (LTCC) [6,7], silicon wafer [8][9][10][11], and other materials [12]. Multilayer PCB is often considered a low-cost technology, but it still suffers from the low integration density of electronic systems and low isolation.…”
Section: Introductionmentioning
confidence: 99%
“…To address the above challenging issues, researchers focus on exploring different fabrication processes to improve the integration and compactness, including multilayer printed circuit board (PCB) [3][4][5], low temperature cofired ceramic (LTCC) [6,7], silicon wafer [8][9][10][11], and other materials [12]. Multilayer PCB is often considered a low-cost technology, but it still suffers from the low integration density of electronic systems and low isolation.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, especially in a MIMO system, it is often hard for a single filter unit to meet the complex filtering requirements of wireless communication system, filters are needed to be combined as a filter bank to process radio frequency signals. In [5–7 ], different types of filters constituted a switchable filter bank which ensures only a single channel at one time. Instead of arranging filter units in‐plane, Billstrom and Sandwall [8 ] presented a novel method for the miniaturisation of a filter bank by 3D‐stacking of filters.…”
Section: Introductionmentioning
confidence: 99%