A diamond made microchannel heat sink for high-density heat flux dissipation

Yang, Qi; Zhao, Jiyun; Huang, Yi; Zhu, Xiaowei; Fu, Weichun; Li, Chengming; Miao, Jun

doi:10.1016/j.applthermaleng.2019.113804

Cited by 61 publications

(15 citation statements)

References 44 publications

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“…Among all known materials, diamond has a record-high thermal conductivity of up to 24 W/cm•K at room temperature, reaching maximum values of up to 285 W/cm•K at temperatures near 63 K [1]. This makes diamond the material of choice for thermal management applications [2][3][4][5][6]. Solving thermal management problems is especially important for modern electronic devices, operating in extreme regimes, which makes diamond a highly used "cutting-edge" material in electronics [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Effect of Substrate Holder Design on Stress and Uniformity of Large-Area Polycrystalline Diamond Films Grown by Microwave Plasma-Assisted CVD

et al. 2020

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In this work, the substrate holders of three principal geometries (flat, pocket, and pedestal) were designed based on E-field simulations. They were fabricated and then tested in microwave plasma-assisted chemical vapor deposition process with the purpose of the homogeneous growth of 100-μm-thick, low-stress polycrystalline diamond film over 2-inch Si substrates with a thickness of 0.35 mm. The effectiveness of each holder design was estimated by the criteria of the PCD film quality, its homogeneity, stress, and the curvature of the resulting “diamond-on-Si” plates. The structure and phase composition of the synthesized samples were studied with scanning electron microscopy and Raman spectroscopy, the curvature was measured using white light interferometry, and the thermal conductivity was measured using the laser flash technique. The proposed pedestal design of the substrate holder could reduce the stress of the thick PCD film down to 1.1–1.4 GPa, which resulted in an extremely low value of displacement for the resulting “diamond-on-Si” plate of Δh = 50 μm. The obtained results may be used for the improvement of already existing, and the design of the novel-type, MPCVD reactors aimed at the growth of large-area thick homogeneous PCD layers and plates for electronic applications.

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Section: Introductionmentioning

confidence: 99%

Effect of Substrate Holder Design on Stress and Uniformity of Large-Area Polycrystalline Diamond Films Grown by Microwave Plasma-Assisted CVD

et al. 2020

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“…However, during the growth process of PCD thin films, defects such as asymmetric thickness, random crystal orientation, and uneven crystal grains frequently occur [63]. These defects lead to a rough surface, which limits the industrial applications of PCD films [69]. Bhat et al [70] reported that the roughness of CVD diamond film on the surface of coated tools greatly impacts the cutting efficiency, machining accuracy, and final surface quality.…”

Section: Pcdmentioning

confidence: 99%

Energy beam-based direct and assisted polishing techniques for diamond: A review

Li,

Jiang,

Jiang

et al. 2023

Int. J. Extrem. Manuf.

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Diamond is a highly valuable material with diverse industrial applications, particularly in the fields of semiconductor, optics, and high-power electronics. However, its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of diamond. To address these challenges, several polishing methods have been developed for both single crystal diamond (SCD) and polycrystalline diamond (PCD), including mechanical, chemical, laser, and ion beam processing methods. In this review, the characteristics and application scope of various polishing technologies for SCD and PCD are highlighted. Specifically, various energy beam-based direct and assisted polishing technologies, such as laser polishing, ion beam polishing, plasma-assisted polishing, and laser-assisted polishing, are summarized. The current research progress, material removal mechanism, and influencing factors of each polishing technology are analyzed. Although some of these methods can achieve high material removal rates or reduce surface roughness, no single method can meet all the requirements. Finally, the future development prospects and application directions of different polishing technologies are presented.

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“…The results showed that the heat flux has a significant effect on the heat transfer coefficient, which indicated that nucleate boiling is the dominant mechanism of heat transfer, but this dominant effect is suppressed at high vapor quality. Yang et al [19] carried out an experimental study of the saturated flow boiling heat transfer of ammonia using a triangular microchannel heat sink and visualized the flow pattern under different vapor qualities. Huang et al [20,21] investigated the effect of different parameters on the heat transfer coefficient of flow boiling in microchannels using R1233zd(E), R245fa and R236fa.…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation on the Heat Transfer Characteristics of Multi-Point Heating Microchannels for Simulating Solar Cell Cooling

et al. 2022

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Concentrating photovoltaic power generation technology is a highly efficient way of utilizing solar energy resources with the efficiency limited by cell cooling conditions. For the heat dissipation problem from multi-point solar cell cooling, a microchannel heat sink is used to resolve the issue. Ammonia is chosen as the working fluid and two diamond microchannel heat sinks in series for the 16 simulated solar cells cooling with typical size. The heat sink consists of 31 triangular microchannels, each with a hydraulic diameter of 237 μm and a flow path length of 40 mm. It is experimentally verified that the diamond microchannel heat sink has excellent multi-point heat source heat dissipation capability. The surface temperature of the heat source can be controlled below 65.9 °C under the heat flux of 351.5 W/cm2, and the maximum temperature difference between the multi-point heat sources is only 1.4 °C. The effects of heat flux, mass flux and inlet state on the flow boiling heat transfer capacity within the series heat sinks were investigated and the ranges of the operating conditions are as follows: heat flux 90.8–351.5 W/cm2, mass flux 108–611 kg/(m2s), saturation temperature 15–23 °C and inlet temperature 15–21 °C. The results show that within the range of experimental conditions, the flow boiling heat transfer capacity of the series heat sink increases with the increase of heat flux and is less influenced by the mass flux, showing the typical two-phase heat transfer characteristics dominated by the nucleation boiling mechanism. Between the upstream and downstream heat sinks, the thermal resistance of the upstream heat sink is larger and the temperature uniformity of the downstream heat sink is poor because of the difference of the inlet state.

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A diamond made microchannel heat sink for high-density heat flux dissipation

Cited by 61 publications

References 44 publications

Effect of Substrate Holder Design on Stress and Uniformity of Large-Area Polycrystalline Diamond Films Grown by Microwave Plasma-Assisted CVD

Effect of Substrate Holder Design on Stress and Uniformity of Large-Area Polycrystalline Diamond Films Grown by Microwave Plasma-Assisted CVD

Energy beam-based direct and assisted polishing techniques for diamond: A review

Experimental Investigation on the Heat Transfer Characteristics of Multi-Point Heating Microchannels for Simulating Solar Cell Cooling

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