A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

Yu, Perman; Huang, Dan; Zhou, Hongcheng; Hu, Yueming

doi:10.1117/12.3007244

First Advanced Imaging and Information Processing Conference (AIIP 2023) 2023

DOI: 10.1117/12.3007244

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A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

Perman Yu,

Dan Huang,

Hongcheng Zhou

et al.

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A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

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References 28 publications

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