2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2013
DOI: 10.1109/iccad.2013.6691152
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A disturb-alleviation scheme for 3D flash memory

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Cited by 20 publications
(5 citation statements)
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“…However, although 3D flash memories present a good opportunity to further increase the capacity as well as reduce the bit cost, some research reports from the industries and the academics have pointed out that multiple potential problems impose huge challenges on adopting 3D flash memories in a typical storage system [22], [81], [76]. In particular, big block [76], [22] and program disturbance [22], [81] are two critical issues that should be considered for garbage collection and wear-leveling.…”
Section: Design Issues In 3d Flash Memory Storagementioning
confidence: 98%
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“…However, although 3D flash memories present a good opportunity to further increase the capacity as well as reduce the bit cost, some research reports from the industries and the academics have pointed out that multiple potential problems impose huge challenges on adopting 3D flash memories in a typical storage system [22], [81], [76]. In particular, big block [76], [22] and program disturbance [22], [81] are two critical issues that should be considered for garbage collection and wear-leveling.…”
Section: Design Issues In 3d Flash Memory Storagementioning
confidence: 98%
“…Want et al [81] proposed to eliminate inter-block disturbance by means of creating a physical distance between neighboring logical blocks. On the contrary, Chang et al [22] proposed a new life cycle of physical block to avoid writing pages whose adjacent pages currently contain valid data so as to reduce intra-block disturbance. Even though those works could resolve the disturbance to a certain degree, they might face new challenges on fulfilling the requirement of garbage collection and wear-leveling.…”
Section: B Program Disturbance Problemmentioning
confidence: 98%
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“…Other optimization schemes such as an initial channel precharge phase [357] and selector doping [358] have been also proposed. In analogy with planar devices, suitable management schemes for 3D NAND have been also proposed [359,360]. Similar considerations apply to vertical-gate structures, in which channel arrays are horizontally stacked with vertical WLs [361,362].…”
Section: Disturbsmentioning
confidence: 99%