A drop-on band-pass filter for millimeter-wave multichip modules on LTCC

Kassner, J.; Menzel, Wolfgang

doi:10.1109/75.808033

Cited by 8 publications

(2 citation statements)

References 7 publications

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“…Several designs were made and investigated with respect to the tolerances of the available LTCC technology; the required accuracy of around or better than 10 gm could not be achieved. As a consequence, a different solution was proposed and tested [11]. The filter was fabricated on a small alumina substrate with its tight tolerances and placed on top of the LTCC substrate.…”

Section: Drop-on Band Pass Filtermentioning

confidence: 99%

Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Menzel

Kassner

2000

30th European Microwave Conference, 2000

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LTCC, HTCC, and similar sandwiched substrate structures provide the basis for highdensity 3D integration and packaging of microwave and mm-wave circuits. Such multilayer substrates serve, at the same time, as carrier substrates for MIMICs and as a medium for high-density hybrid circuits which can be realized in a manifold of transmission line types in different substrate layers and combinations of these, coupled directly or via the electromagnetic field. This contribution will address a number of aspects of such substrates, especially for mm-wave applications, and it will provide two examples of realized circuit elements and components. One is a multilayer electromagnetically coupled feed-through structure into a package on top of the multilayer substrate, the other one a band pass filter in a mixed alumina -LTCC layer system to cope with the tolerance requirements of mm-wave filters in a standard production LTCC environment.

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Section: Drop-on Band Pass Filtermentioning

confidence: 99%

Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Menzel

Kassner

2000

30th European Microwave Conference, 2000

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“…Therefore, quasi planar components that can be directly interconnected with a planar passive network did receive much interest in the past few years [1]. In the same time, silicon bulk micromachining technique emerged as a promising solution to achieve collective precise machining that is required to build high Q monolithic resonant structures [2].…”

Section: Introductionmentioning

confidence: 99%

Integrated Millimeter-Wave Silicon Micromachined Filters

Blondy¹,

Baleras

Cros³

et al. 2000

30th European Microwave Conference, 2000

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-This paper describes the design and the fabrication of a new type of millimeter-wave micromachined band pass filters, using silicon waveguides. The main interest of these components is their ability to be integrated along with other MMICs using flip chip bonding techniques. The micromachining fabrication technique allows to maintain very good fabrication tolerances, while the resulting filters are very compact. The design methodology is presented along with two examples of two and four pole filters at 42 GHz.

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LTCC bandpass filter for Bluetooth™ application with dual transmission zeros

Dai

Hai-shen

et al. 2008

2008 International Conference on Microwave and Millimeter Wave Technology

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A LTCC band-pass filter with dual transmission zeros for Bluetooth™ application was presented. With the classic network synthesis method, a lumped LC filter was educed and then transformed to physical prototype with LTCC process. This prototype was refined with DOE method, and was implemented in Zhejiang Zhengyuan Electric Co. Ltd. The measured insertion loss is less than 1.8dB at 2400MHz, and two transmission zeros are obtained at 1.7 and 7.1 GHz, respectively. They result in 40-45dB for lower stop band suppression and 45-50dB for higher stop band reduction. The experimental data agree very well with the 3-D simulation.

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A drop-on band-pass filter for millimeter-wave multichip modules on LTCC

Cited by 8 publications

References 7 publications

Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Integrated Millimeter-Wave Silicon Micromachined Filters

LTCC bandpass filter for Bluetooth™ application with dual transmission zeros

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A drop-on band-pass filter for millimeter-wave multichip modules on LTCC

Cited by 8 publications

References 7 publications

Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Integrated Millimeter-Wave Silicon Micromachined Filters

LTCC bandpass filter for Bluetooth&#x2122; application with dual transmission zeros

Contact Info

Product

Resources

About

LTCC bandpass filter for Bluetooth™ application with dual transmission zeros