A Dual-Imaging Speed-Enhanced CMOS Image Sensor for Real-Time Edge Image Extraction

Kim, Hyeon‐June; Hwang, Sun-Il; Chung, Jaywan; Park, Jong-Ho; Ryu, Seung‐Tak

doi:10.1109/jssc.2017.2718665

Cited by 16 publications

(5 citation statements)

References 20 publications

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“…In order to reduce the FPN of the prototype APD, the off-chip digital offset adjustment was performed as in Refs. [20,21] so that the variation of APD can be reduced from 3.9 % to less than 0.1 % as shown in Figure 16. However, as the InGaAs APD was implemented as 16 partitioned cells in the prototype chip, the variation of APD is larger than the conventional one inducing the fixed pattern noise (FPN) [19], as shown in Figure 15a,b).…”

Section: Measurement Resultsmentioning

confidence: 98%

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High Spatial Resolution Three-Dimensional Imaging Static Unitary Detector-Based Laser Detection and Ranging Sensor

et al. 2019

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This paper presents a static unitary detector (STUD)-based laser detection and ranging (LADAR) sensor with a 16-to-1 transimpedance-combining amplifier for high spatial resolution three-dimensional (3-D) applications. In order to readout the large size of a photodetector for better results of 3-D information without any reduction of the bandwidth, the partitioning photosensitive cell method is embedded in a 16-to-1 transimpedance-combining amplifier. The effective number of partitioning photosensitive cells and signal-combining stages are selected based on the analysis of the partitioning photosensitive cell method for the optimum performance of a transimpedance-combining amplifier. A prototype chip is fabricated in a 0.18-μm CMOS technology. The input referred noise is 41.9 pA/√Hz with a bandwidth of 230 MHz and a transimpedance gain of 70.4 dB·Ω. The total power consumption of the prototype chip is approximately 86 mW from a 1.8-V supply, and the TICA consumes approximately 15.4 mW of it.

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Section: Measurement Resultsmentioning

confidence: 98%

Section: Measurement Resultsmentioning

confidence: 98%

High Spatial Resolution Three-Dimensional Imaging Static Unitary Detector-Based Laser Detection and Ranging Sensor

et al. 2019

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“…This made it difficult to clarify the distinct range information. In order to reduce the pixel FPN of the prototype APD, off-chip digital offset adjustment was performed as off-chip calibration as in [17,23], so that the offset difference between neighboring pixels could be reduced to under 1 LSB. After offset adjustment, the pixel FPN was reduced to less than 0.1%.…”

Section: Measurement Results and Discussionmentioning

confidence: 99%

A High-Multi Target Resolution Focal Plane Array-Based Laser Detection and Ranging Sensor

Kim

Lee

Kim

2019

Sensors

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This paper introduces a digital-assisted multiple echo detection scheme, which utilizes the waste time of the full serial data readout period in a focal plane array (FPA)-based laser detection and ranging (LADAR) receiver. With the support of an external digital signal processor (DSP) and additional analog memory inserted into the receiver, the proposed readout scheme can effectively enhance multi-target resolution (MTR) three times higher than the conventional FPA-based LADAR, while maintaining low power consumption and a small area. A prototype chip was fabricated in a 0.18-μm CMOS process with an 8 × 8 FPA configuration, where each single receiver pixel occupied an area of 100 μm × 100 μm. The single receiver achieved an MTR of 20 ns with 7.47 mW power dissipation, an input referred noise current of 4.48 pA/√Hz with a bandwidth 530 MHz, a minimum detectable signal (MDS) of 340 nA, a maximum walk error of 2.2 ns, and a maximum non-linearity of 0.05% among the captured multiple echo images.

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“…Various studies have been reported on low-power circuit design [5]- [7] in literature for specific operating conditions. In addition, low-power readout techniques that are optimized for the characteristics of input signals [8]- [10] and specific operations related to applications [11]- [14] have been reported. For example, Park et al [7] achieved low power consumption by adopting a fully dynamic CIS structure; however, this structure is not suitable for high-speed operation because it suffers from high readout noise due to increased global supply signal and power-line fluctuations.…”

Section: Introductionmentioning

confidence: 99%

A Low-Power CMOS Image Sensor With Multiple-Column-Parallel Readout Structure

Hyeon

Kim

2022

IEEE J. Electron Devices Soc.

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This paper presents a low-power multiple-column-parallel (MCP) readout CMOS image sensor (CIS) in terms of its structural features. Because each column in an MCP unit performs analogto-digital (A/D) conversion sequentially, the columns have their own operating periods before and after A/D conversion. Upon completion of A/D conversion in each column, a local bias control (LBC) scheme is applied using a bias circuit of a pixel source follower (SF) to minimize power consumption. In this study, the effectiveness of the proposed LBC scheme is verified for the MCP readout structure. Through simple modification of a column-biasing circuit, the prototype MCP readout CIS achieved significant power savings, which shows its applicability to low-power CIS applications. The prototype CIS was implemented using a 1P6M 0.18-µm CMOS process. A maximum frame rate of 430 fps was achieved while consuming 2.38 mW of power. Compared to a conventional column driver, the proposed LBC scheme reduces the total power consumption by 29.4%, which is an overall power savings of 15%. The prototype CIS also demonstrated figures of merit of 119.1 µV•nJ and 8 µV rms /kHz. INDEX TERMS CMOS image sensor (CIS), pixel source follower, column driver, bias voltage control technique, local bias control (LBC) scheme, multiple-column-parallel (MCP) readout.JANG-SU HYEON (Student Member, IEEE) received the B.S. degree from the

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A Dual-Imaging Speed-Enhanced CMOS Image Sensor for Real-Time Edge Image Extraction

Cited by 16 publications

References 20 publications

High Spatial Resolution Three-Dimensional Imaging Static Unitary Detector-Based Laser Detection and Ranging Sensor

High Spatial Resolution Three-Dimensional Imaging Static Unitary Detector-Based Laser Detection and Ranging Sensor

A High-Multi Target Resolution Focal Plane Array-Based Laser Detection and Ranging Sensor

A Low-Power CMOS Image Sensor With Multiple-Column-Parallel Readout Structure

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