A facile strategy for modifying boron nitride and enhancing its effect on the thermal conductivity of polypropylene/polystyrene blends

Jiang, Xueliang; Ma, Pengfei; You, Feng; Yao, Chu; Yao, Junlong; Liu, Fangjun

doi:10.1039/c8ra06140h

Cited by 26 publications

(22 citation statements)

References 42 publications

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“…The illustration of the entire preparation procedure was presented in Figure . The total weight ratio of PP and PS is fixed at 4:6 in order to achieve the double‐percolation structure as discussed in our previous work . The content of BN loading was also fixed at 14.5 wt% in this work.…”

Section: Methodsmentioning

confidence: 99%

“…The total weight ratio of PP and PS is fixed at 4:6 in order to achieve the double-percolation structure as discussed in our previous work. [7] The content of BN loading was also fixed at 14.5 wt% in this work. Finally, the composites were prepared by hot-pressing with a certain shape for test.…”

Section: Sample Preparationmentioning

confidence: 99%

“…Most of them are electrical insulation although they possess versatile processing characteristics and excellent mechanical property. [5][6][7] Typically, incorporating thermal conductive fillers is the most efficient method to improve the TC of the polymer materials, such as graphite, [8] graphene, [9] carbon nanotube, [10] carbon fibers, [11] and metallic fillers, for instance, silver particles, [12] silver nanowires. [13] However, the electrical insulation performance of materials by using these conductive fillers will be greatly deteriorated, leading to the limited application as respect of microelectronics devices.…”

Section: Introductionmentioning

confidence: 99%

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Simultaneously enhancing the thermal conductivity and dielectric constant of BN/CF hybrid filled polypropylene/polystyrene composites via in situ reactive processing

Jiang

Zhou

et al. 2019

Polymer Composites

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Thermal conductive and electrical insulating polymer composites are exerted a tremendous fascination on the field of thermal management. The effective utilization of fillers is indispensable to construct the thermal conductive pathway to fabricate high thermal conductive polymer composites. Herein, a facile approach involves selective localization of boron nitride (BN) and carbon fiber (CF) through in situ polymerization of styrene through reactive processing as well as double‐percolation structure design. These composites can be easily fabricated by blending the BN, CF with polystyrene during the polymerization of styrene monomer and secondary compounding with polypropylene (PP). The selective localization of BN and CF was observed by scanning electron microscope (SEM) characterization. The cocontinuous structure of PP/PS was also confirmed by SEM observation. The thermal conductivity values was promoted from 0.22 W/mk for PP/PS blends to 0.62 W/mk for the in situ reactive blending composites with 14.5 wt% BN and 18 wt% CF. Moreover, the dielectric properties were also higher than that of the simple melt blending composites. Therefore, the method we proposed provides a potentially feasible plan to design and prepare the thermal conductive and electrical insulating composites for thermal management applications.

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Section: Methodsmentioning

confidence: 99%

Section: Sample Preparationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Simultaneously enhancing the thermal conductivity and dielectric constant of BN/CF hybrid filled polypropylene/polystyrene composites via in situ reactive processing

Jiang

Zhou

et al. 2019

Polymer Composites

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“…The simplest and most direct way to obtain h-BNs functionalized with -OH is heating the raw material in air, e.g., 1000°C for 2 h [30,34,35]. The hydroxyl groups allow a further BNs functionalization.…”

Section: Hydroxylated Bn Micron-scale Materials Direct Hydroxyl-modifmentioning

confidence: 99%

“…Herein, the reaction between organosilane and -OH groups on h-BN surface permits a uniform dispersion of the particles into an epoxy resin. Another example is the modification of hydroxyl-activated BNs by 3-aminopropyltriethoxysilane (APTES) [35]. A BNpolystyrene (PS) composite has been obtained by in situ polymerization of styrene with the presence of APTES-BNs.…”

Section: Hydroxylated Bn Micron-scale Materials Direct Hydroxyl-modifmentioning

confidence: 99%

Hydroxylated boron nitride materials: from structures to functional applications

2020

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Functionalization of boron nitride (BN) materials with hydroxyls has attracted great attention to accomplish better performances at micro- and nanoscale. BN surface hydroxylation, in fact, induces a change in properties and allows expanding the fields of application. In this review, we have summarized the state-of-the-art in developing hydroxylated bulk and nanoscale BN materials. The different synthesis routes to develop hydroxyl BN have been critically discussed. What emerges is the great variety of possible strategies to achieve BN hydroxylation, which, in turn, represents one of the most suitable methods to improve the solubility of BN nanomaterials. The improved stability of BN solutions creates conditions for producing high-quality nanocomposites. Furthermore, new interesting optical and electronic properties may arise from the functionalization by OH groups as displayed by a wide range of both theoretical and experimental studies. After the presentation of the most significant systems and methodologies, we question of future perspective and important trends of the next generation BN materials as well as the possible areas of advanced research. Graphical abstract Hydroxyl functionalization of boron nitride materials is a key method to control and enhance the properties and design new functional applications.

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A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Wang

Weng

et al. 2023

Adv Funct Materials

105

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Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance and leading to life/property loss. Benefiting from their low density, easy processing and low manufacturing cost, thermally conductive polymer composites have become a research hotspot to mitigate the disadvantage of excessive heat, with potential applications in 5G communication, electronic packaging and energy transmission. By far, the reported thermal conductivity coefficient (λ) of thermally conductive polymer composite is far from expectation. Deeper understanding of heat transfer mechanism is desired for developing next generation thermally conductive composites. This review holistically scopes current advances in this field, while giving special attention to critical factors that affect thermal conductivity in polymer composites as well as the thermal conduction mechanisms on how to enhance the λ value. This review covers critical factors such as interfacial thermal resistance, chain structure of polymer, intrinsic λ value of different thermally conductive fillers, orientation/configuration of nanoparticles, 3D interconnected networks, processing technology, etc. The applications of thermally conductive polymer composites in electronic devices are summarized. The existing problems are also discussed, new challenges and opportunities are prospected.

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A facile strategy for modifying boron nitride and enhancing its effect on the thermal conductivity of polypropylene/polystyrene blends

Abstract: Selective localization of BN in the polystyrene phase byin situpolymerization of styrene can enhance the thermal conductivity of polymer blends.

Cited by 26 publications

References 42 publications

Simultaneously enhancing the thermal conductivity and dielectric constant of BN/CF hybrid filled polypropylene/polystyrene composites via in situ reactive processing

Simultaneously enhancing the thermal conductivity and dielectric constant of BN/CF hybrid filled polypropylene/polystyrene composites via in situ reactive processing

Hydroxylated boron nitride materials: from structures to functional applications

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

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