A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules

Usui, Masanori; Kuwahara, Makoto; Satoh, Toshifumi

doi:10.1016/j.microrel.2022.114785

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A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules

Cited by 3 publications

References 19 publications

Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications

Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications

Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps

Prediction of Defect Distribution in Solder Joint Using Device Stress Toward Prognostic Health Management of Power Modules

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