A fiber optical voltage sensor prepared by micromachining and wafer bonding

Xiao, Z.; Norrman, S.; Engström, Olof

doi:10.1016/0924-4247(94)80133-9

Cited by 5 publications

(1 citation statement)

References 3 publications

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“…Broad research activity has resulted in increasing knowledge of the mechanical and electrical properties of wafer bonded interfaces, especially those involving crystalline silicon and its oxide [7,8]. This possibility, to add silicon crystalline material as solid building blocks to one another, makes it possible to create novel optical and electrical structures beyond the domain of standard methods of semiconductor device fabrication [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

The influence of pressure on the optical properties of artificial microcavities in silicon

Xiao

Engström

Vidovic³

1997

Semicond. Sci. Technol.

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The effects of external pressure on artificial microcavities prepared by thermal bonding in silicon have been investigated using interferometer techniques. The cavities were bounded on one side by a membrane. When a varying external pressure bends the membrane a corresponding variation in the light flux leaving the interferometer due to interference can be measured. A Fabry-Perot analysis can be applied locally to describe the interference phenomena. Numerical calculations based on the finite element method were performed to simulate the membrane bending and the light flux from the structure at different pressures.

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Section: Introductionmentioning

confidence: 99%