A Fine Pitch Bump Bonding Process compatible with the Manufacture of the Pixel-HPD~s for the LHCb RICH Detector

Abstract

Abstract-A new approach to photo detection using pixel Hybrid Photon Detectors (pixel-HPD's) has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high sensitivity, low noise and fast readout.