A finite element technique for accurate determination of interfacial adhesion force in MEMS using electrostatic actuation

Shavezipur, Mohammad; Li, G H; Laboriante, Ian; Gou, Wenjuan; Carraro, Carlo; Maboudian, Roya

doi:10.1088/0960-1317/21/11/115025

Cited by 12 publications

(4 citation statements)

References 34 publications

(49 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It thus abstains from resolving the exact kinematics of adhesion and contact at the fiber scale and applies an effective energy gain per unit length of contacting parallel fiber segments and solves for the corresponding bundle segment lengths as additional unknowns. Finally, an example for the electrostatic interaction of a double-clamped microbeam with a flat rigid electrode in a microelectromechanical system is given in [16].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the peeling and pull-off behavior of adhesive elastic fibers via a novel computational beam interaction model

Grill

Meier

Wall

2019

The Journal of Adhesion

View full text Add to dashboard Cite

This article studies the fundamental problem of separating two adhesive elastic fibers based on numerical simulation employing a recently developed finite element model for molecular interactions between curved slender fibers. Specifically, it covers the two-sided peeling and pull-off process starting from fibers contacting along its entire length to fully separated fibers including all intermediate configurations and the well-known physical instability of snapping into contact and snapping free. We analyze the resulting force-displacement curve showing a rich and highly nonlinear system behavior arising from the interplay of adhesion, mechanical contact interaction and structural resistance against (axial, shear and bending) deformation. While similar to one-sided peeling studies from the literature, a distinct initiation and peeling phase can be observed, the two-sided peeling setup considered in the present work reveals the extended final pull-off stage as third characteristic phase. Moreover, the influence of different material and interaction parameters such as Young's modulus as well as type (electrostatic or van der Waals) and strength of adhesion is critically studied. Most importantly, it is found that the maximum force occurs in the pull-off phase for electrostatic attraction, but in the initiation phase for van der Waals adhesion. In addition to the physical system behavior, the most important numerical aspects required to simulate this challenging computational problem in a robust and accurate manner are discussed. Thus, besides the insights gained into the considered two-fiber system, this study provides a proof of concept facilitating the application of the employed model to larger and increasingly complex systems of slender fibers.

show abstract

Section: Introductionmentioning

confidence: 99%

Investigation of the peeling and pull-off behavior of adhesive elastic fibers via a novel computational beam interaction model

Grill

Meier

Wall

2019

The Journal of Adhesion

View full text Add to dashboard Cite

show abstract

“…Excessive adhesion force may also result in permanent stiction and catastrophic failure. The adhesion force depends on the material and surface properties and ambient conditions [27]- [31]. In this section, we show that the rigidelectrode NEM relay design can provide larger restoring force and control the pull-in/pull-out window by changing the source geometry.…”

Section: Adhesion Force and Pull-in/pull-out Hysteresismentioning

confidence: 98%

“…ANSYS coupled-field multiphysics solver was used to model the electrostatic and structural domains. This finite element solver has been demonstrated to precisely predict the pull-in voltage and electro-mechanical behavior of MEMS devices [27]. In this FEM model, the source, drain and gate are modeled in structural domain and the air surrounding them is meshed in electrostatic domain.…”

Section: B Contact Pressure and On-state Resistancementioning

confidence: 99%

Partitioning Electrostatic and Mechanical Domains in Nanoelectromechanical Relays

Shavezipur

Harrison

Lee

et al. 2015

J. Microelectromech. Syst.

View full text Add to dashboard Cite

This paper describes the improvement of pull-in stability, contact properties, and reliability of laterally actuated nanoelectromechanical relays by partitioning the mechanical and electrostatic domains in the relay structure. Separation of the two physics allows us to individually optimize the structural stiffness and the actuation voltage to increase the contact pressure and reduce the ON-state resistance without applying excessive drain voltage. The devices can tolerate more than 200% overdrive gate voltage, resulting in near 100% increase in contact force, and reducing the contact resistance from ∼10 G to ∼23 K . For a given overall device dimension, tailoring the mechanical and electrostatic elements independently also enables us to control the pull-in and pull-out voltages, which have different design requirements for different applications. The measurement results show that the pull-in/pull-out hysteresis could vary between 30% and 60% of the actuation (pull-in) voltage. Increasing the mechanical force without affecting the device actuation voltage improves the relay reliability by reducing the possibility of failure due to source-drain stiction when the relay is switched ON. As a proof of concept, mechanical relays are fabricated using polycrystalline silicon coated by a titanium nitride layer deposited via plasma enhanced atomic layer deposition.[2014-0018] IndexTerms-Nanoelectromechanical systems, low power electronics, laterally actuated relay, partitioning electrostatic-structural domains, contact reliability.

show abstract

“…Corresponding FE implementations are described in [120] and [123]. Numerical examples for electro-static interactions are given in [254] and [123].…”

Section: Electro-static Interactionsmentioning

confidence: 99%

A Survey of Computational Models for Adhesion

Sauer

2015

The Journal of Adhesion

View full text Add to dashboard Cite

This work presents a survey of computational methods for adhesive contact focusing on general continuum mechanical models for attractive interactions between solids that are suitable for describing bonding and debonding of arbitrary bodies. The most general approaches are local models that can be applied irrespective of the geometry of the bodies. Two cases can be distinguished: local material models governing the constitutive behavior of adhesives, and local interface models governing adhesion and cohesion at interfaces in the form of traction-separation laws. For both models various subcategories are identified and described, and used to organize the available literature that has contributed to their advancement. Due to their popularity and importance, this survey also gives an overview of effective adhesion models that have been formulated to characterize the global behavior of specific adhesion problems.

show abstract

A finite element technique for accurate determination of interfacial adhesion force in MEMS using electrostatic actuation

Cited by 12 publications

References 34 publications

Investigation of the peeling and pull-off behavior of adhesive elastic fibers via a novel computational beam interaction model

Investigation of the peeling and pull-off behavior of adhesive elastic fibers via a novel computational beam interaction model

Partitioning Electrostatic and Mechanical Domains in Nanoelectromechanical Relays

A Survey of Computational Models for Adhesion

Contact Info

Product

Resources

About