A Flat Heat Pipe Architecture Based on Nanostructured Titania

Ding, Chenxu; Soni, Gaurav; Bozorgi, Payam; Piorek, Brian; Meinhart, Carl; MacDonald, N.C.

doi:10.1109/jmems.2010.2051019

Cited by 112 publications

(44 citation statements)

References 11 publications

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“…Researchers at the University of California Santa Barbara explored fabrication of all-titanium vapor chambers [189,190]. Relative to other potential materials, titanium offers excellent corrosion resistance, light weight, high fracture toughness, and can be used as the substrate for microfabrication of high-aspect-ratio wick features [191].…”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…Ding et al [189] fabricated a proof-of-concept device having external dimensions of 30 mm × 30 mm × 0.6 mm for thermal ground plane applications (Figure 29f). The internal wick structures were titanium pillars (10 μm diameter, 15 μm pitch) oxidized to form secondary nanostructured titania (NST) surface features (fabrication details in [189]).…”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…The internal wick structures were titanium pillars (10 μm diameter, 15 μm pitch) oxidized to form secondary nanostructured titania (NST) surface features (fabrication details in [189]). …”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…The vapor chamber was sealed along the edge by local laser welding to avoid heating the entire device to the necessary processing temperatures. By applying a fixed temperature difference between evaporator and condenser sections, the fabrication proof-of-concept device achieved a maximum effective thermal conductivity of ~350 W/mK at this form factor [189].…”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…This approach has been previously used to increase the capillarity of titanium [189] and copper [48] micropost wick structures.…”

Section: Nanostructured Coatingsmentioning

confidence: 99%

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Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…This approach has been previously used to increase the capillarity of titanium [189] and copper [48] micropost wick structures.…”

Section: Nanostructured Coatingsmentioning

confidence: 99%

See 3 more Smart Citations

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Molecular dynamics simulation of condensation on nanostructured surface in a confined space

Li¹,

Zhang

2016

Appl. Phys. A

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Understanding heat transfer characteristics of phase change and enhancing thermal energy transport in nanoscale are of great interest in both theoretical and practical applications. In the present study, we investigated the nanoscale vaporization and condensation by using molecular dynamics simulation. A cuboid system is modeled by placing hot and cold walls in the bottom and top ends and filling with working fluid between the two walls. By setting two different high temperatures for the hot wall, we showed the normal and explosive vaporizations and their impacts on thermal transport. For the cold wall, the cuboid nanostructures with fixed height, varied length, width ranging from 4 to 20 layers, and an interval of four layers are constructed to study the effects of condensation induced by different nanostructures. For vaporization, the results showed that higher temperature of the hot wall led to faster transport of the working fluid as a cluster moving from the hot wall to the cold wall. However, excessive temperature of the hot wall causes explosive boiling, which seems not good for the transport of heat due to the less phase change of working fluid. For condensation, the results indicate that nanostructure facilitates condensation, which could be affected not only by the increased surface area but also by the distances between surfaces of the nanostructures and the cold end. There is an optimal nanostructure scheme which maximizes the phase change rate of the entire system.

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A novel method for characterization of liquid transport through micro-wicking arrays

Ravi

Horner

Moghaddam

2013

Microfluid Nanofluid

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A Flat Heat Pipe Architecture Based on Nanostructured Titania

Cited by 112 publications

References 11 publications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Molecular dynamics simulation of condensation on nanostructured surface in a confined space

A novel method for characterization of liquid transport through micro-wicking arrays

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