2017
DOI: 10.1016/j.bios.2016.12.011
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A flexible and miniaturized hair dye based photodetector via chemiluminescence pathway

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Cited by 14 publications
(5 citation statements)
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“…At present, different analytical methods have been applied to detect H 2 O 2 , such as fluorescence, liquid chromatography, surface-enhanced Raman scattering, chemiluminescence, and electrochemistry . Among them, electrochemical technology has been widely applied due to its easy operation, high sensitivity, and high selectivity. Traditional H 2 O 2 sensors usually use natural enzymes as the receptor, but the low stability and complex immobilization process limit their application .…”
Section: Introductionmentioning
confidence: 99%
“…At present, different analytical methods have been applied to detect H 2 O 2 , such as fluorescence, liquid chromatography, surface-enhanced Raman scattering, chemiluminescence, and electrochemistry . Among them, electrochemical technology has been widely applied due to its easy operation, high sensitivity, and high selectivity. Traditional H 2 O 2 sensors usually use natural enzymes as the receptor, but the low stability and complex immobilization process limit their application .…”
Section: Introductionmentioning
confidence: 99%
“…Some applications are shown in Figure 1. In terms of substrates, conventional silicon, and mature technologies have attained micro structures and ultrathin chips, which strengthen its flexibility (Lin C. C. et al, 2017;Navaraj et al, 2018). However, compared with this complicated process, the method for fabricating devices directly on the soft, bendable and skin-mounted polymer substrates, such as polyethylene (PE) and terephthalate (PET) is more advantageous.…”
Section: Introductionmentioning
confidence: 99%
“…To achieve the flexibility of the Si substrate, the wet etching process was utilized to cut the thickness of the Si substrate. As the thickness of the Si substrate approached 30 μm, the substrate attained flexibility [ 41 ]. Traditionally, chemical-mechanical planarization (CMP) process has been utilized to slim the thickness of silicon substrate.…”
Section: Resultsmentioning
confidence: 99%