A Flush Mount Packaging Concept for a Mems Microphone Array for Aero-Acoustic Measurements

Abstract

This paper presents a new approach to package a MEMS microphone for flight tests on airplanes for noise measurements. The package consists of a conventional thinned printed circuit board (PCB) with a cavity, in which the sensor chip is attached. The electrical connections are done with very shallow wire-bonds and the cavity is then sealed with a soft silicone gel. First a brief introduction on the measurement of noise in flight tests is given, followed by the measurement scenario addressed in this paper. The most common packaging approach for MEMS microphones is explained and a new concept for thinner and smaller sensor systems is presented, followed by testing procedures.