A fracture mechanics approach to thermal fatigue life prediction of solder joints

Pao, Yi-Hsin

doi:10.1109/33.159886

Cited by 74 publications

(12 citation statements)

References 44 publications

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“…Pao 16 has considered the application of fracture mechanics to thermal fatigue life prediction in some depth. Assuming that deformation and increments of crack growth from time‐independent and time‐dependent origins are additive, cyclic crack growth is best described by Δ J , and when creep conditions dominate, the use of C * is appropriate.…”

Section: The Application Of Fracture Mechanicsmentioning

confidence: 99%

Structural integrity in electronics

Plumbridge¹,

Kariya²

2004

Fatigue Fract Eng Mat Struct

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A B S T R A C T With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver-containing lead-free solders is superior to that of the traditional Sn-37Pb under cycle-controlled conditions but there is no difference when time-dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation.

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Section: The Application Of Fracture Mechanicsmentioning

confidence: 99%

Structural integrity in electronics

Plumbridge¹,

Kariya²

2004

Fatigue Fract Eng Mat Struct

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“…Finite element (FE) simulations have been widely used in analyzing the failures of the electronic packages to explore the directions of design improvement. Indeed there are numerous studies of solder joint reliability of the electronic packaging under the thermo-mechanical and bending load in the literature [1][2][3][4][5][6][7]. Though an accurate prediction of the thermal and bending fatigue life using numerical simulations is not an easy task, one of the biggest advantages of the numerical simulations over the experimental investigation is that it is possible to isolate the effect of certain parameters on the system response and investigate the effects of each individual design variable or a group of design variables.…”

Section: Introductionmentioning

confidence: 99%

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Xu¹,

Reinikainen²,

Ren³

et al. 2004

Microelectronics Reliability

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“…Rodgers et al [10] have presented the test results for 95.5Sn3.8AgO.7Cu, but their curves of Anand are quite different to those obtained by Reinikainen et al [11] for 95.5Sn4.OAgO.5Cu. There are a lot of papers that have studied the solder joint reliability including the fatigue life prediction [12][13][14][15][16][17][18][19]. A generalized solder joint fatigue life model for surface mount packages is based on correlation to measured crack growth data on CSP joints during thermal cycling [18,20].…”

Section: Introductionmentioning

confidence: 99%

Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP

Wang

Zhang

et al. 2007

2007 8th International Conference on Electronic Packaging Technology

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A series of tensile tests for Pb-free solder material 95.7Sn3.8AgO.5Cu have been conducted under a wide range of temperatures and constant strain rates to obtain the required data for fitting the material parameters of Anand model. Based on these test results, empirical equations of the tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. It is found that the temperature and strain rate have demonstrated crucial effects on tensile and creep properties of SnAgCu solder material. The test results have also displayed certain viscoplastic behavior, temperature dependence, strain rate sensitivity and creep resistance. A procedure for the determination of Anand material parameters through data fitting is proposed to find nine Anand constants. Three-dimensional finite element analysis has been applied to predict the fatigue life of solder joints under thermal cycling conditions. Finally the solder joint life prediction and comparison of Pb-free material 95.7Sn3.8AgO.5Cu and standard Pb material 62Sn36Pb2Ag solder for a CSP are examined.

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A fracture mechanics approach to thermal fatigue life prediction of solder joints

Cited by 74 publications

References 44 publications

Structural integrity in electronics

Structural integrity in electronics

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP

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