A Full-component recyclable Epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability

Liu, Jingkai; Feng, Haoyang; Dai, Jinyue; Yang, Kang; Chen, Guangmeng; Wang, Shuaipeng; Jin, Dandan; Liu, Xiaoqing

doi:10.1016/j.cej.2023.143963

Cited by 43 publications

(12 citation statements)

References 56 publications

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“…To visually demonstrate the exceptional performance of the core–shell structure fiber filler h‐BN@AT, as designed in this study, a comparative analysis was conducted with recent research findings on polymer composites exhibiting high λ || , as depicted in Figure 7D 49–59 . Under the same filling amount, the new filler h‐BN@AT designed in this article can more effectively improve the λ of composites, which is significantly better than other reports.…”

Section: Resultsmentioning

confidence: 86%

“…(C) Thermal transfer behavior of different composites as simulated by simulation. (D) Comparison of the λ of h‐BN@AT/EP with previous works 49–59 …”

Section: Resultsmentioning

confidence: 87%

“…[49][50][51][52][53][54][55][56][57][58][59] Under the same filling amount, the new filler h-BN@AT designed in this article can more effectively improve the λ of composites, which is significantly better than other reports. [49][50][51][52][53][54][55][56][57][58][59] F I G U R E 8 Weibull breakdown fitting distribution of composite: (A) h-BN@AT-III/EP with different filler contents, (B) composites with various fillers at a filling content of 30 wt%.…”

Section: Thermal Conductivity Of H-bn@at/epmentioning

confidence: 77%

“…To visually demonstrate the exceptional performance of the core-shell structure fiber filler h-BN@AT, as designed in this study, a comparative analysis was conducted with recent research findings on polymer composites exhibiting high λ jj , as depicted in Figure 7D. [49][50][51][52][53][54][55][56][57][58][59] Under the same filling amount, the new filler h-BN@AT designed in this article can more effectively improve the λ of composites, which is significantly better than other reports. [49][50][51][52][53][54][55][56][57][58][59] F I G U R E 8 Weibull breakdown fitting distribution of composite: (A) h-BN@AT-III/EP with different filler contents, (B) composites with various fillers at a filling content of 30 wt%.…”

Section: Thermal Conductivity Of H-bn@at/epmentioning

confidence: 95%

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Highly thermally conductive electrically insulating composites composed of core–shell structure fiber boron nitride@titanium dioxide filler

Yang,

Feng,

Liang

et al. 2023

Polymer Composites

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With the increasing integration and power density of electronic and electrical equipment, highly thermally conductive insulating materials have a wide range of application scenarios. In this paper, a novel core–shell structure fiber thermal conductive filler hexagonal boron nitride@anatase titanium dioxide (h‐BN@AT) has been prepared by electrospinning technology first. The h‐BN@AT/epoxy resin (EP) thermally conductive and insulating composite was prepared by hot pressing. When the filler content was 30 wt%, the optimal thermal conductivity (λ) of h‐BN@AT/EP composite was 7.62 W/(m·K) (in‐plane) and 0.76 W/(m·K) (out‐of‐plane), which were 3088% and 324% higher than EP. The incorporation of high aspect ratio core–shell structural fibers significantly improves the efficiency of thermal conduction (TC) pathways formation within the composite. Moreover, the utilization of one‐dimensional (1‐D) anatase titanium dioxide fiber (ATO) and two‐dimensional (2‐D) boron nitride (h‐BN) establishes a multi‐level TC channel in EP, significantly increasing the λ of the composite. Notably, the composite retains outstanding insulation properties. The innovative core–shell structural fibers filler developed in this study provides a feasible method for producing thermal conductivity insulating materials.Highlights A new type of core–shell structure h‐BN@AT fiber filler is designed. High thermal conductivity insulating composite h‐BN@AT/EP are prepared by hot pressing. h‐BN@AT can effectively improve the thermal conductivity of composite to ensure good electrical properties. The effect of h‐BN content in h‐BN@AT filler on the properties of the composite was obtained. The superiority of h‐BN@AT in heat conduction is verified by the classical heat conduction model and simulation.

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Section: Resultsmentioning

confidence: 86%

“…(C) Thermal transfer behavior of different composites as simulated by simulation. (D) Comparison of the λ of h‐BN@AT/EP with previous works 49–59 …”

Section: Resultsmentioning

confidence: 87%

Section: Thermal Conductivity Of H-bn@at/epmentioning

confidence: 77%

Section: Thermal Conductivity Of H-bn@at/epmentioning

confidence: 95%

See 2 more Smart Citations

Highly thermally conductive electrically insulating composites composed of core–shell structure fiber boron nitride@titanium dioxide filler

Yang,

Feng,

Liang

et al. 2023

Polymer Composites

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“…[22] Vitrimers with covalently cross-linked networks and dynamic exchange reactions capability provide a possible solution to the above contradictions. [23,24] Vitrimers are a class of cross-linked networks based on associative dynamic covalent bonds. [25][26][27] Researches have demonstrated that vitrimers possess excellent reprocessability, self-healing capability, and high thermal/chemical stability.…”

Section: Introductionmentioning

confidence: 99%

Fast Degradable and Thermally Conductive Silicone Rubber Vitrimer with Low Dielectric and UV‐Shielding Properties

Zhang,

Dang,

Zhang

2023

Macro Chemistry & Physics

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Silicone rubbers have been widely employed in various fields such as electronics, electrical engineering, mobile communications, aerospace, and automotive industries. However, silicone rubbers are typically challenging to reprocess and degrade. Moreover, with the advancement of technology, higher demands have been placed on its thermal conductivity and dielectric properties. In this study, diglycidyl ether terminated polydimethylsiloxane was cured by 4,4′‐dithiodibutyric acid which contains dual dynamic covalent disulfide and ester bonds with triazobicyclodecene as the ester exchange catalyst to prepare silicone rubber vitrimers (SRVs) through a casting method. The SRVs demonstrated a relatively higher intrinsic thermal conductivity of 0.26 W/(m·K) compared to ∼0.20 W/(m·K) of conventional silicone rubber. Besides, the SRVs exhibited very low and stable dielectric constant and dielectric loss at both low and high frequencies (X‐band). The lowest dielectric constant and dielectric loss tangent at 10 GHz were 2.75 and 0.0639, respectively. Besides, the dual dynamic covalent bonds enabled the SRVs to have excellent reprocessability and fast degradability. Moreover, the SRVs revealed UV‐shielding capability, as the transmittance of the SRVs was 0% from 200 to 400 nm of UV light.This article is protected by copyright. All rights reserved

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Boron nitride nanosheets synergized with two‐dimensional micron silver sheets to enhance thermal conductivity and insulation of epoxy resin composites

Zhang,

Xiao,

Liang

et al. 2024

J of Applied Polymer Sci

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With the rapid progress of the advanced electronic device industry, precision electronic instruments are gradually developing towards miniaturization. In this case, epoxy resin gradually attracts people's attention, but its intrinsic thermal conductivity is not high, and the resulting heat dissipation problem limits the further application of epoxy resin in the field of electronic packaging. Therefore, how to enhance the thermal conductivity of epoxy resins has become an urgent problem in the field of electronic packaging. In this work, BNNS was successfully prepared by stripping h‐BN into a flaky two‐dimensional material, which was added to the epoxy resin as a filler to make the composite material. And on the basis of the above, two‐dimensional micron silver flakes (AgMS) with different mass fractions were added to the composites, and the AgMS/BNNS/EP composites were successfully prepared. When BNNS was 25 wt% and AgMS was 1 wt%, its out‐of‐plane thermal conductivity was enhanced from 0.17 W m−1 K−1 of pure epoxy resin to 0.43 W m−1 K−1. When BNNS was 20 wt% and AgMS was 1 wt%, the breakdown strength was enhanced from 105 kV/mm for pure epoxy to 130 kV/mm. This work provides a new strategy for synthesizing high‐thermal‐conductivity epoxy matrix composites.

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A Full-component recyclable Epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability

Cited by 43 publications

References 56 publications

Highly thermally conductive electrically insulating composites composed of core–shell structure fiber boron nitride@titanium dioxide filler

Highly thermally conductive electrically insulating composites composed of core–shell structure fiber boron nitride@titanium dioxide filler

Fast Degradable and Thermally Conductive Silicone Rubber Vitrimer with Low Dielectric and UV‐Shielding Properties

Boron nitride nanosheets synergized with two‐dimensional micron silver sheets to enhance thermal conductivity and insulation of epoxy resin composites

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