A full-field warpage characterization measurement method coupled with infrared information

Zeng, Baoshan; Gao, Yuhan; Xiong, Chuanguo; Lei, Xin; Lv, Weishan; Zhu, Fulong

doi:10.1016/j.microrel.2023.115237

Microelectronics Reliability

2023

DOI: 10.1016/j.microrel.2023.115237

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A full-field warpage characterization measurement method coupled with infrared information

Baoshan Zeng,

Yuhan Gao,

Chuanguo Xiong

et al.

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2024

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Cited by 3 publications

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Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics

Wan,

Dong,

Sun

et al. 2024

Microelectronics Reliability

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Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics

Wan,

Dong,

Sun

et al. 2024

Microelectronics Reliability

View full text Add to dashboard Cite

A review on warpage measurement metrologies for advanced electronic packaging

Sun,

Zhang

2024

Microelectronics Reliability

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Warpage: Causes, manufacturing processes and future challenges: A review

Coca-Gonzalez,

Jimenez-Martinez

2024

Proceedings of the Institution of Mechanical Engineers, Part L:

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Currently, in the manufacturing industry, there are many different component manufacturing processes. Each of them has its own advantages and disadvantages. One phenomenon present in some processes is known as warpage. Essentially, warpage is unwanted deformation in a component caused by internal stresses, thermal variations, uneven cooling of the part, the presence of moisture or the release of residual stresses in the material. Although it is a common problem in some engineering fields, it occurs mainly in processes such as injection moulding, compression moulding and 3D printing. There are different measurement and mitigation techniques that are adapted to each process. This paper discusses the causes of the phenomenon and current and future mitigation techniques. Additionally, an overview of upcoming techniques aimed at fully mitigating and measuring this phenomenon in real time during manufacturing processes is presented.

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A full-field warpage characterization measurement method coupled with infrared information

Cited by 3 publications

References 25 publications

Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics

Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics

A review on warpage measurement metrologies for advanced electronic packaging

Warpage: Causes, manufacturing processes and future challenges: A review

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