A Fully Embedded 60-GHz Novel BPF for LTCC System-in-Package Applications

Lee, Young Chul; Park, Chul Soon

doi:10.1109/tadvp.2006.884807

Cited by 32 publications

(29 citation statements)

References 10 publications

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“…Each line and transition length is 330 and 100 µm, respectively. The detail design method was reported in detail [5]. The filter responses are analyzed as a function of the patch size, length of the feed lines, and diameter of the lower-via pads.…”

Section: Design Of a Fully Embedded Stripline Bpfmentioning

confidence: 99%

“…Several types of BPFs [5][6][7][8][9][10] using various structures and technologies have been developed for low-loss and 3-D integration in RF SoP modules. Particularly, a dual-mode stripline BPF [5] using the novel vertical via transition [11] was integrated into the 60 GHz transmitter LTCC SoP module [2].…”

Section: Introductionmentioning

confidence: 99%

“…Particularly, a dual-mode stripline BPF [5] using the novel vertical via transition [11] was integrated into the 60 GHz transmitter LTCC SoP module [2]. LTCC dual-mode cavity and vertically stacked multi-pole filters have been demonstrated at 60 GHz [6].…”

Section: Introductionmentioning

confidence: 99%

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A LOW-LOSS PATCH LTCC BPF FOR 60 GHZ SYSTEM-ON-PACKAGE (SoP) APPLICATIONS

Kim

2009

PIER Letters

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Abstract-In this paper, a three-dimensional (3-D) low-loss and wideband BPF based on lowtemperature co-fired ceramic (LTCC) has been presented for 60 GHz wireless communication applications. Via pads in the vertical via transitions are designed as an additional resonator for lowloss and wide-bandwidth of the BPF. The proposed BPF has been designed by investigating its characteristics as a function of dimensions of the resonators such as a single-mode patch and via pads and also a length of feed lines are optimized for effective coupling. The designed BPF was fabricated in a 6-layer LTCC dielectric. The fabricated BPF shows a centre frequency (fc) of 61.46 GHz and a 3 dB bandwidth of 10.5% from 58.2 to 64.7 GHz (6.47 GHz). An insertion loss of −2.88 dB at fc and return losses below −10 dB are achieved. Its whole size is 4.72 × 1.7 × 0.684 mm 3 .

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Section: Design Of a Fully Embedded Stripline Bpfmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A LOW-LOSS PATCH LTCC BPF FOR 60 GHZ SYSTEM-ON-PACKAGE (SoP) APPLICATIONS

Kim

2009

PIER Letters

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“…These applications are required to operate above 10 GHz to have larger data rate and affordable capacity on industrial scientific medical (ISM) band. Furthermore, applications of millimeter wave range over 10 GHz require high cost package substrate materials to satisfy low loss and stable process as shown in previous studies [1][2][3]. Although wafer level packaging technologies have been used for some time for low-frequency analog and digital applications, they have recently been applied to packaging of millimeter wave components.…”

Section: Introductionmentioning

confidence: 99%

Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application

Lee¹,

Kim²,

Karim³

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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In this paper, development of wafer level fan-out (WLFO) technology using ajinomoto build-up film (ABF) substrate with laser ablation process is introduced for low cost and high electrical performance for millimeter wave application. Wafer level fan-out (WLFO) technology using ABF substrate can enhance routing density and provide smaller form factor with lower parasitic elements than flip-chip chip scale packages (FCCSP). Moreover, short electrical paths from die out to package out can be realized with WLFO, and the low-k ABF material provides good electrical properties for high frequency areas. In this paper, the process of WLFO using ABF substrate with laser drilling is explained and electrical parasitic elements are compared between FCCSP and WLFO using 3D simulation tools. In addition, electrical characterization of coplanar waveguide (CPW) structure and interconnection models from die I/O pad to balls using 3D EM simulation are conducted to estimate effectiveness on millimeter wave range. Actual measurements of CPW structures are also presented.

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“…The three-dimensional (3D) integration approach using multilayer low-temperature co-fired ceramic (LTCC) technologies has emerged as an attractive solution for these 60 GHz systems owing to its high level of compactness and mature multilayer fabrication capability. Various bandpass filters [1][2][3][4] based on LTCC and the substrate integrated waveguide (SIW) have been introduced for V-band applications. To develop a high-isolation diplexer for the 60 GHz applications, two narrowband bandpass filters operating at two adjacent frequencies could be employed as in [2].…”

mentioning

confidence: 99%

60 GHz LTCC 3D cavity bandpass filter with two finite transmission zeros

2011

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A novel 60 GHz three-dimensional (3D) cavity bandpass filter using low-temperature co-fired ceramic technology is presented. The proposed filter shows two finite transmission zeros with each at either side of the passband using the extracted-pole and cross-coupling techniques. Both simulated and experimental results of the filter are described.Introduction: In most countries, several gigahertz of bandwidth is now available in the 60 GHz band. The three-dimensional (3D) integration approach using multilayer low-temperature co-fired ceramic (LTCC) technologies has emerged as an attractive solution for these 60 GHz systems owing to its high level of compactness and mature multilayer fabrication capability. Various bandpass filters [1-4] based on LTCC and the substrate integrated waveguide (SIW) have been introduced for V-band applications. To develop a high-isolation diplexer for the 60 GHz applications, two narrowband bandpass filters operating at two adjacent frequencies could be employed as in [2]. It is noted that the bandpass filter has no finite transmission zeros so that the isolation between two channels of the diplexer may not be optimised. An LTCC V-band dual-mode filter with two transmission zeros was presented in [4] by using cross-coupling. However, it has a poor in-band performance and its transmission zeros cannot be controlled independently.In this Letter, we present a 60 GHz narrowband cavity bandpass filter having two finite transmission zeros to meet the need of sharp cutoff skirts. The transmission zero below the passband is achieved by using the extracted-pole technique [5 -7] while the transmission zero above the passband is achieved by using the cross-coupling technique [8,9]. These two transmission zeros can be controlled individually to the desired frequencies. The designed high-selectivity narrowband bandpass filter can be further employed to develop a high-isolation V-band diplexer.

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A Fully Embedded 60-GHz Novel BPF for LTCC System-in-Package Applications

Cited by 32 publications

References 10 publications

A LOW-LOSS PATCH LTCC BPF FOR 60 GHZ SYSTEM-ON-PACKAGE (SoP) APPLICATIONS

A LOW-LOSS PATCH LTCC BPF FOR 60 GHZ SYSTEM-ON-PACKAGE (SoP) APPLICATIONS

Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application

60 GHz LTCC 3D cavity bandpass filter with two finite transmission zeros

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