A fuzzy hierarchical reinforcement learning based scheduling method for semiconductor wafer manufacturing systems

Wang, Junliang; Gao, Pengjie; Zheng, Peng; Zhang, Jie; Ip, W. H.

doi:10.1016/j.jmsy.2021.08.008

Cited by 15 publications

(2 citation statements)

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“…Cluster tools are highly automated and integrated equipment that are broadly applied in wafer fabrication processes [13], [14]. To effectively improve the production efficiency and yield rate of wafers, many scholars have extensively investigated these problems regarding the scheduling and control of single-armed cluster tools with different constraints.…”

Section: ) Scheduling Analysis and Optimizing Of Cluster Toolsmentioning

confidence: 99%

“…Thus, the vibration angular displacement θ10 , θ20 , θ30 at the end moment of braking process of the torsional vibration system can be calculated by (14). Obviously, the greater the acceleration of the braking process of the torsional vibration system, the greater the inertial force F I of the system, which leads to the greater the vibration angular displacements θ10 , θ20 , θ30 of the torsional vibration system of manipulator.…”

Section: Vibration Attenuation Characteristicsmentioning

confidence: 99%

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Influence of Dynamic Accuracy Constraints of Manipulator of Wafer Transmission Robot on Scheduling and Control of Single-Armed Cluster Tools

Zheng

2023

IEEE Access

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The wafer transfer robot is a key part of integrated circuit equipment which performs the transit of wafers precisely, quickly and steadily. The dynamic accuracy of the manipulator of the wafer transfer robot directly affects the quality of transferring and processing wafers and even the scheduling and control of the cluster tools. Thus, it is essential to study the influence of the dynamic accuracy of the manipulator of wafer transmission robots on the scheduling and control of cluster tools. In this paper, single-arm cluster tools are taken as the research object. The horizontal torsional vibration equations of the manipulator of the R-θ robot are constructed, and the torsional vibration attenuation characteristics of the manipulator are analyzed. Based on the torsional vibration equations, the intrinsic relationships between the dynamic accuracy of the manipulator and the waiting times of the manipulator are explored when the manipulator loads and unloads the wafers. Then the two-stage approach is proposed for the scheduling and control of single-arm cluster tools. The first stage determines the minimum waiting times of the manipulator according to the intrinsic relationships between the dynamic accuracy of the manipulator and the waiting times of the manipulator when the manipulator is waiting for loading and unloading wafers in each processing module and load lock. The second stage achieves the scheduling optimization and control of single-arm cluster tools with dynamic accuracy constraints and wafer residency time constraints by establishing a mathematical programming model for the scheduling and control of single-arm cluster tools. Finally, illustrative examples are presented to analyze the influence of the dynamic accuracy of the manipulator on the scheduling and control of single-arm cluster tools.

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Section: ) Scheduling Analysis and Optimizing Of Cluster Toolsmentioning

confidence: 99%

Section: Vibration Attenuation Characteristicsmentioning

confidence: 99%