A gel-based wafer-level testing procedure for microelectrodes

Kindlundh, Maria; Norlin, P.

doi:10.1016/j.snb.2004.11.016

Cited by 6 publications

(3 citation statements)

References 11 publications

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“…For these devices, impedance values were measured to be less than 20 k at 1 kHz. For both gold and platinum electrodes, our measured impedance values were smaller than those reported elsewhere, with values normalized to the electrode area [20,21,[41][42][43]. We believe this is because the electrode surface was roughened during the DRIE step in our process.…”

Section: Device Characterizationcontrasting

confidence: 65%

Microfabrication of 3D neural probes with combined electrical and chemical interfaces

John

Zhang

et al. 2011

J. Micromech. Microeng.

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This paper reports a novel neural probe technology for the manufacture of 3D arrays of electrodes with integrated microchannels. This new technology is based on a silicon island structure and a simple folding procedure. This method simplifies the assembly or packaging process of 3D neural probes, leading to higher yield and lower cost. Prototypes with 3D arrays of electrodes have been successfully developed. Microchannels have been successfully integrated into the 3D neural probes via isotropic XeF2 gas phase etching and a parylene resealing process. The probes have been characterized by scanning electron microscopy imaging, optical imaging, impedance analysis, and atomic force microscopy characterization of the electrode surface. Preliminary animal tests have been carried out to demonstrate the recording functionality of the probes. Flow characteristics of the microchannels were also preliminarily measured.

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Section: Device Characterizationcontrasting

confidence: 65%

Microfabrication of 3D neural probes with combined electrical and chemical interfaces

John

Zhang

et al. 2011

J. Micromech. Microeng.

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“…after dicing, bonding, encapsulation and mounting processes. This is an uneconomical approach, because the interconnection, encapsulation and packaging costs for microsystems can be very high, typically in the order of 55-85% of the total production costs [1,2]. These costs are further wasted for non-functioning chips (bad dies, see Figure 1).…”

Section: Introductionmentioning

confidence: 99%

“…Such a technique in combination with appropriate electrochemical techniques (e.g., cyclic voltammetry, electrochemical impedance spectroscopy and scanning electrochemical impedance spectroscopy) has been utilised for wafer-level quality control of microelectrodes [5]. In addition, a gel-based wafer-level testing procedure for microelectrodes has been suggested in [2]. However, due to the small gate sizes of ISFETs, special techniques are needed to reproducibly produce and control small droplets of a test sample.…”

Section: Introductionmentioning

confidence: 99%

Functional Testing and Characterisation of ISFETs on Wafer Level by Means of a Micro-droplet Cell

Poghossian

Schumacher

Kloock

et al. 2006

Sensors

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Abstract:A wafer-level functionality testing and characterisation system for ISFETs (ionsensitive field-effect transistor) is realised by means of integration of a specifically designed capillary electrochemical micro-droplet cell into a commercial wafer prober-station. The developed system allows the identification and selection of "good" ISFETs at the earliest stage and to avoid expensive bonding, encapsulation and packaging processes for nonfunctioning ISFETs and thus, to decrease costs, which are wasted for bad dies. The developed system is also feasible for wafer-level characterisation of ISFETs in terms of sensitivity, hysteresis and response time. Additionally, the system might be also utilised for wafer-level testing of further electrochemical sensors.

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Functional testing and characterisation of (bio-)chemical sensors on wafer level

2009

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An automated computer-assisted system for the testing and characterisation of (bio-)chemical sensors on wafer level is developed and integrated into a commercial prober station. The system enables the identification and selection of "good" sensors on wafer level and thus, allows avoiding expensive bonding, encapsulation and packaging processes for defective or non-functioning sensor structures. Moreover, a specifically designed flow-through electrochemical microcell offers the possibility of wafer-level characterisation of (bio-)chemical sensors in terms of sensitivity, hysteresis and response time at an early process stage. The system has been exemplarily tested using wafers combining pH-sensitive field-effect transistors with different geometrical sizes and gate layouts.

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A gel-based wafer-level testing procedure for microelectrodes

Cited by 6 publications

References 11 publications

Microfabrication of 3D neural probes with combined electrical and chemical interfaces

Microfabrication of 3D neural probes with combined electrical and chemical interfaces

Functional Testing and Characterisation of ISFETs on Wafer Level by Means of a Micro-droplet Cell

Functional testing and characterisation of (bio-)chemical sensors on wafer level

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