1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389-4)
DOI: 10.1109/mwsym.1994.335214
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A general interface between TLM models and lumped element circuit models

Abstract: discussed for the case of a lumped nonlinear diode and a lumped element generator embedded in a microstrip circuit. The microstrip circuit is modeled via TLM whereas the lumped element models are described by the state space approach. ABSTRACTWe describe the interfacing of transmission line matrix models of distributed microwave circuits with lumped element models. The lumped element circuits are connected with the distributed circuit via a line guiding only its fun-2 Interface of TLM Model with TEM Line damen… Show more

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Cited by 9 publications
(6 citation statements)
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“…The general interface technique introduced in [6] is used for field excitation as well as the extraction of currents and voltages at the ports. Then we apply system identification methods for the generation of compact circuit models for the distributed sub-circuits.…”
Section: Theorymentioning
confidence: 99%
“…The general interface technique introduced in [6] is used for field excitation as well as the extraction of currents and voltages at the ports. Then we apply system identification methods for the generation of compact circuit models for the distributed sub-circuits.…”
Section: Theorymentioning
confidence: 99%
“…To overcome this problem, many methods based on co-modeling have been proposed to design complex RF components, circuits and modules containing passive and/or active domains [1][2][3][4][5][6][7][8][9][10][11][12]. Numerical electromagnetic methods developed in the spectral or time domain are coupled to physical and/or circuit methods for hybrid modeling of complex structures.…”
Section: Introductionmentioning
confidence: 99%
“…Their electrical behaviors are described by Kirchoff laws and are modeled by equivalent lumped element circuits or measurements. Lumped accesses [6,7] placed inside the meshed volume allow the connection between the distributed passive part and the localized domain. Using this technique, it is possible to consider both the MMICs behaviors, the EM packaging and/or parasitic coupling effects.…”
Section: Introductionmentioning
confidence: 99%
“…Full-wave analysis methods used for the modeling of distributed parts have to be combined with lumped subcircuits. One possible way is to directly integrate lumped elements into a full-wave analysis [1]- [3], but it is advantageous to separate EM and network simulation combining the single simulation results afterwards [4]. This procedure reduces the modeling effort and increase efficiency.…”
Section: Introductionmentioning
confidence: 99%