A general solution on stress singularities in an anisotropic wedge

Chue, Ching‐Hwei; Liu, Chuan-I

doi:10.1016/s0020-7683(01)00015-4

Cited by 41 publications

(30 citation statements)

References 28 publications

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“…For the anisotropic wedge, the cases compared are listed in Table 2. The computed stress singularity orders of these wedges are exactly the same as those obtained from Chue and Liu (2001). Chue and Chen (2002) used the generalized Lekhnitskii formulation to obtain the singularity orders of the piezoelectric and graphite-epoxy/piezoelectric bonded wedges for type A continuity conditions.…”

Section: Numerical Results and Discussionmentioning

confidence: 91%

“…Wedge angle h 1 = 0°, h 2 = 90°, h 3 = 180°h 1 = 0°, h 2 = 180°, h 3 = 180°F iber orientation b 1 = 45°b 1 = 0°b 2 = À45°b 2 = 90°P resent À0.494309 À0.5 À0.0214846 Chue and Liu (2001) À0.494309 À0.5 À0.0214846 Table 3 The stress singularity orders (Às À 2) of the piezoelectric/piezoelectric and graphite-epoxy/piezoelectric bonded wedges In this section, all the numerical results are computed from the specific temperature field of Eq. (46).…”

Section: Numerical Results and Discussionmentioning

confidence: 99%

“…The stress singularity orders of the decoupled problems are compared with some selected isotropic and anisotropic elastic material wedges, which have been widely investigated in the past (Theocaris, 1974;Chen and Nisitani, 1992;Chue and Liu, 2001). Table 1 lists the stress singularity orders of two isotropic bonded wedges.…”

Section: Numerical Results and Discussionmentioning

confidence: 99%

“…Several mathematical tools, such as the eigenfunction expansion (Williams, 1952), Mellin transform (Bogy, 1968(Bogy, , 1972Ma and Hour, 1989), complex potential functions (Theocaris, 1974;Delale, 1984;Chen and Nisitani, 1992;Chen, 1998;Chue and Liu, 2001) have been applied in solving the stress singularity orders in isotropic or anisotropic bonded wedges.…”

Section: Introductionmentioning

confidence: 99%

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On the singularities of the thermo-electro-elastic fields near the apex of a piezoelectric bonded wedge

Chen¹

2006

International Journal of Solids and Structures

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Based on the generalized Lekhnitskii formulation and Mellin transform, the thermo-electro-elastic fields of a piezoelectric bonded wedge are investigated in this paper. From the potential theory in a wedge-shaped region, a general form of the temperature change is proposed as a particular solution in the generalized Lekhnitskii formulation. The emphasis is on the singular behavior near the apex of the piezoelectric bonded wedge, including singularity orders and angular functions, which can be computed numerically. The interface between two materials can be either perfectly bonded, namely type A, so that the continuity of electric displacements holds, or a thin electrode, namely type B, so that the electric potential is grounded. Case studies of PZT-5H/PZT-4 and graphite-epoxy/PZT-4 bonded wedges reveal that, in most cases, the type B continuity condition has more severe singularities than type A due to the mixed boundary point of the electrostatics at the apex of the wedge. The results of this study show that the reduction or disappearance of singularity orders is possible through the appropriate selection of poling/fiber orientations and wedge angles.

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Section: Numerical Results and Discussionmentioning

confidence: 91%

Section: Numerical Results and Discussionmentioning

confidence: 99%

Section: Numerical Results and Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

On the singularities of the thermo-electro-elastic fields near the apex of a piezoelectric bonded wedge

Chen¹

2006

International Journal of Solids and Structures

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“…The stress singularity problems of the edge of bonded bimaterial beams were discussed by some scholars (Kang et al 1995) [5]. The stress singularities in an anisotropic wedge was analyzed (Chue et al2001) [6]. The failure models and strength criterions were studied experimentally (Basaran et al 2005 andPark et al 2002) [7,8].…”

Section: Introductionmentioning

confidence: 99%

Stress Analysis Near the Welding Interface Edges of a QFP Structure under Thermal Loading

Huang

Ping

Liu

2011

Computer and Computing Technologies in Agriculture IV

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Abstract. The purpose of this paper was to investigate the reason why the interface delaminations occurred in the QFP structure. The stress concentration was the key factor responsible for the microcrack occurrence. In order to figure out which factors affect the stress distribution, the material's attributes and the structure's dimension were considered. The finite element program ABAQUS6.9 together with the analytical solutions of singular stress fields was used to calculate the stresses near the interface edges. In conclusion, it appeared that strong mismatches of the thermal expansion coefficients and material elastic constants of the chip and PCB would lead to serious singular stresses at the interface edges. Stress intensity factor K and stress singularity order λ were given, based on which failure criterions could be established to predict the potential interface delamination. It is suggested that the good design of packaging structure depends on proper material selection and dimension determination.

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Stress Concentration Near Notch in Anisotropic Body

Savruk

Kazberuk

2016

Stress Concentration at Notches

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A general solution on stress singularities in an anisotropic wedge

Cited by 41 publications

References 28 publications

On the singularities of the thermo-electro-elastic fields near the apex of a piezoelectric bonded wedge

On the singularities of the thermo-electro-elastic fields near the apex of a piezoelectric bonded wedge

Stress Analysis Near the Welding Interface Edges of a QFP Structure under Thermal Loading

Stress Concentration Near Notch in Anisotropic Body

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