2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2012
DOI: 10.1109/icept-hdp.2012.6474729
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A GTLE and FDFD algorithm for analysis of power integrity in PCBs and packages

Abstract: The numerical simulations of power integrity in electronic packages become more and more significant, which help us to understand the characteristic of power distribution network. In this work, a simple and efficient method synthesizing 2D generalized transmission line equations (GTLE) and finite-difference frequency-domain (FDFD) is proposed for power integrity simulation. The combined method can simulate power/ground plane pair surface mounted with lumped circuit elements such as decoupling capacitor. Severa… Show more

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