2020
DOI: 10.1109/access.2020.3007365
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A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Abstract: Interconnect structure, as the weak point of reliability, is often the critical part in electronic devices during their service. In order to monitor the health state and degradation of interconnect structure, the charging time is used as the health indicator for interconnect structure of QFP package in this paper. Firstly, a monitoring circuit, based on the proposed electrical model of interconnect structure, is designed to measure the charging time in real time. Secondly, the equivalent circuit of the monitor… Show more

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Cited by 3 publications
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