Abstract:Barrier chemical mechanical planarization (CMP) is a critical process in the manufacturing of integrated circuits (ICs). Bacterial infestation, the material removal rate (MRR) selectivity and slurry aging are important factors in the evaluation of barrier CMP slurry. In this paper, H2O2 concentration in a lower level was used to adjust the rate selectivity and enhance removal rate on copper to ensure the trench copper thickness reaches the target value. The effects of dodecyl dimethyl benzyl ammonium chloride … Show more
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