A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
Jeng-Hau Huang,
Po-Shao Shih,
Vengudusamy Renganathan
et al.
Abstract:This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challeng… Show more
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