“…At the same time, the continuous pursuit of costeffective manufacturing is increasingly redirecting the research efforts to the chemical solution-based coating approaches, because they do not require expensive high-vacuum processing chambers. Additionally, the chemical solution deposition processes has other advantages, such as large area atmospheric deposition capabilities, easy operation, and component adjustment [5,6]. But till now, CuI thin films synthesized by chemical solution processes such as spin-coating, spraying, ink-jet printing, and vacuum-assisted filtration of a CuI suspension, contain unwanted impurities from the precursor solutions, have insufficient electrical conductivity 𝜎 [2,5,8], and, as a result, their thermoelectric power factor 𝑃 = 𝜎𝑆 2 is small or even negligible (here, 𝑆 is the Seebeck coefficient).…”