C-H diamond metal-oxide-semiconductor field effect transistors with different structures were fabricated on the same polycrystalline diamond plate. Devices A and B with 25-nm-thick high temperature (300 • C) atomic layer deposition grown Al 2 O 3 dielectric have the same source-to-drain distance of 6 µm and different gate length of 2 µm and 6 µm, respectively. Both devices show ultra-high on/off ratio of over 10 10 and ultra-low gate leakage of below 10 −10 A and continuous measurement stability. Device B with the source/drain-channel interspaces eliminated has achieved an on resistance of 46.20 •mm, which is record low in the reported 6-µm H-diamond MOSFETs with the gate dielectric prepared at high temperature (≥ 300 • C). Meanwhile, device B shows larger drain current in a large portion of the linear region at V GS = −6 V, and a just slightly smaller I Dmax compared with device A though its L G is three times of that of device A. A simple model of I D was used to explain the physics behind this phenomenon. In addition, the breakdown voltage is 145 V for device A and 27 V for device B, corresponding to the average breakdown field of about 0.72 MV/cm and 10.8 MV/cm, respectively.