A High-Power-Density Integrated Electronic Ballast for Low Wattage HID Lamps

Jiang, Yan; Liu, Wenduo; Yan, Liang; Wyk, J.D. van; Lee, Fred C.

doi:10.1109/apex.2007.357526

Cited by 9 publications

(3 citation statements)

References 13 publications

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“…In this work, a passive filter was designed and added as part of the EB to remove the noise. 18 Another category of line noise is called harmonics. Harmonics can degrade power quality performance by causing distortions in the electric signal, i.e.…”

Section: Introductionmentioning

confidence: 99%

Design and simulation of electronic ballast performance for high pressure sodium street lighting

Omar

Rahman

Majid

et al. 2013

Lighting Research & Technology

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A novel method of reducing the energy consumption of street lighting using electronic ballasts was simulated on 277 units of 250 W high pressure sodium (HPS) street lights for a month. The design of the electronic ballast is detailed. A control system was utilised to dim the lights at hours of reduced traffic. The energy consumption was compared to that of the conventional system. The electronic ballast operates at a higher frequency and corrects any power distortion in the supply. Together with the light dimming capability, the electronic ballast increased the efficiency of the lighting system resulting in a monthly saving of 10.7 MWh, giving a monthly equivalent carbon dioxide reduction of 6.1 tonnes. In Malaysia, this would translate to a monthly cost saving of 37.7%.

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Section: Introductionmentioning

confidence: 99%

Design and simulation of electronic ballast performance for high pressure sodium street lighting

Omar

Rahman

Majid

et al. 2013

Lighting Research & Technology

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“…Passive components with different heights and shapes are typically assembled in 2D on a single PCB, resulting in a lot of air enclosed within system boundaries and consequently large size of the systems. Thermal performance and miniaturization of power passive components have often been the topic of past research [3], [4], [5], [6], [7], [8]. However, automated placement and feasibility for 3D assembly of passive components have not been adequately addressed.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance of double-sided SMT capacitors: Operation and soldering

Josifovic

Huesgen

Popović

et al. 2013

2013 IEEE ECCE Asia Downunder

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This manuscript investigates thermal performance of x-dimension (x-dim) passive components, during operation and soldering by means of 3D FEM thermal simulations and experiments. X-dim components feature standardized height, double-sided SMT terminations, and improved thermal behaviour and can be stacked between PCBs to achieve 3D spatial layout. During components operation, standard passives with different shapes are suitable for convection-while x-dim components with standardized geometry, for conduction heat transfer from their surfaces. Conduction heat transfer is found to be more effective than convection, especially for passives inside a sealed enclosure. Further, the paper shows how x-dim components can be utilized for the heat conduction from other passives in a stacked assembly. With respect to reflow soldering of passives, phase-change-is clearly identified as superior over convection-heat transfer. Phase-change soldering is, through number of thermal simulations and experiments, proven to be effective for soldering of power passive x-dim components.

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“…A conventional way of CM/DM choke integration is to utilize the leakage inductance of the CM inductor as the DM inductor. However leakage inductance is limited by the winding structure, geometry and characteristic of the CM core material [1].Adding magnetic shunt is a efficient method to increase the leakage inductance, but it requires specific designed structure with customized cores [4,5,6,7]. Applying magnetic gel provides another way to increase the leakage inductance without specific customized core design.…”

Section: Introductionmentioning

confidence: 99%

An integrated common mode and differential mode choke for EMI suppression using magnetic epoxy mixture

Luo

Boroyevich

Mattevelli

et al. 2011

2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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CM and DM chokes are the majority parts in EMI filters, which take big portion of total system volume and weight. Integration technology can help on integrating the CM and DM chokes together and reduce the total volume and weight, helps on improving power density of the converters. This paper proposed a CM /DM integrated choke using magnetic mixture (magnetic gel). Applying the magnetic gel around the CM inductor can contain the leakage flux within the gel, so that it can help reduce the inductive coupling between EMI filter components. Simulation and experimental results show the potential of this material in magnetic integration.

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A High-Power-Density Integrated Electronic Ballast for Low Wattage HID Lamps

Cited by 9 publications

References 13 publications

Design and simulation of electronic ballast performance for high pressure sodium street lighting

Design and simulation of electronic ballast performance for high pressure sodium street lighting

Thermal performance of double-sided SMT capacitors: Operation and soldering

An integrated common mode and differential mode choke for EMI suppression using magnetic epoxy mixture

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