A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

Takano, Kunihiko; Yamaguchi, Yo; Nagamine, Shinji; Toriyama, Yasuhiro; Taniguchi, Tomoyo; Uehara, K.

doi:10.1109/emicc.2007.4412635

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Cited by 11 publications

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A Highly Integrated Quasi-millimeter Wave Transmitter MMIC Using 3D-MMIC Technology

Yamaguchi

Takano

Uehara

et al. 2007

2007 Asia-Pacific Microwave Conference

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A highly integrated quasi-millimeter-wave transmitter MMIC that integrates 26 circuits in a 3 mm x 3 mm area using three-dimensional MMIC (3D-MMIC) technology is presented. The power dissipation of the MMIC is only 0.54 W. It achieved a high P1dB of 6 dBm and gain of 19 dB at 26 GHz. Furthermore, it integrated step attenuators with a new built-in inverter using an N-channel depression FET for transmit power control.

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