2021
DOI: 10.1145/3488900
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A Holistic Solution for Reliability of 3D Parallel Systems

Abstract: Monolithic 3D technology is emerging as a promising solution that can bring massive opportunities, but the gains can be hindered due to the reliability issues exaggerated by high temperature. Conventional reliability solutions focus on one specific feature and assume that the other required features would be provided by different solutions. Hence, this assumption has resulted in solutions that are proposed in isolation of each other and fail to consider the overall compatibility and the implied overheads of mu… Show more

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