In silicon carbide (SiC) planar insulated-gate bipolar transistor (IGBT), a large distance between neighboring p-bodies is beneficial to enhance the on-state conductivity modulation, but will expose the gate oxide to high electric field in off-state. With p-bodies placed closer, the gate oxide field is reduced, but the conductivity modulation is suppressed. In this work, a new SiC planar IGBT with oxide shield is proposed and studied by TCAD simulations. The proposed SiC IGBT achieves improved trade-off between on-state voltage drop (VON) and maximum gate oxide electric field (Eox-m). When a quite larger distance between neighboring p-bodies is adopted in the proposed SiC IGBT, a low VON is obtained, while the Eox-m can be kept at a small value with the oxide shielding structures protecting the gate oxide. Switching characteristics are also studied, and the proposed SiC-IGBT delivers much better trade-off between turn-off energy loss (EOFF) and VON than the conventional SiC planar IGBT.Index Terms-SiC IGBT, oxide shield, on-state voltage drop, maximum gate oxide electric field, turn-off energy loss.
I. INTRODUCTIONUE to the superior properties of silicon carbide (SiC), such as wide bandgap, large critical electric field, and high temperature endurance, SiC based devices are widely studied for high-power and high-temperature applications [1][2][3][4][5][6]. For