A Hybrid Fuzzy Decision Model for Evaluating MEMS and IC Integration Technologies

Abstract

Integrated devices incorporating MEMS (microelectromechanical systems) with IC (integrated circuit) components have been becoming increasingly important in the era of IoT (Internet of Things). In this study, a hybrid fuzzy MCDM (multi-criteria decision making) model was proposed to effectively evaluate alternative technologies that incorporate MEMS with IC components. This model, composed of the fuzzy AHP (analytic hierarchy process) and fuzzy VIKOR (VIseKriterijumska Optimizacija I Kompromisno Resenje) methods, solves the decision problem of how best to rank MEMS and IC integration technologies in a fuzzy environment. The six important criteria and the major five alternative technologies associated with our research themes were explored through literature review and expert investigations. The priority weights of criteria were derived using fuzzy AHP. After that, fuzzy VIKOR was deployed to rank alternatives. The empirical results show that development schedule and manufacturing capability are the two most important criteria and 3D (three-dimensional) SiP (system-in-package) and monolithic SoC (system-on-chip) are the top two favored technologies. The proposed fuzzy decision model could serve as a reference for the future strategic evaluation and selection of MEMS and IC integration technologies.

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

“…Table 1 [ 11 , 12 ] displays a comparison of the traits of the three levels. The SiP design is based on the SoC [ 13 ], and the PCB is also required to execute the functionality when the SiP design is finished.…”

“…Chiplets are closely related to many advanced packaging technologies, so some people even consider Chiplets as an extension and expansion of the SiP. Table 1 [11,12] displays a comparison of the traits of the three levels. The SiP design is based on the SoC [13], and the PCB is also required to execute the functionality when the SiP design is finished.…”

Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”

“…For the packaging based on bonding technologies, attention should be paid to thermal expansion coefficient difference among the associated materials because it would cause undesired high packaging stress. Packaging stress is a principal cause of its reliability, and thus modeling and simulation of electronic and MEMS packages have been frequently performed through FEM (Finite Element Method) to understand mechanical behavior of the packages [ 13 , 14 , 15 , 16 , 17 ]. To obtain reliable simulation results, material properties and their behavior depending on temperature or external load should be well characterized.…”